Two senior-level appointments boost EnSilica’s rapidly expanding SoC design and supply services
EnSilica and Solomon Systech in multi-year eSi-RISC licensing deal
EnSilica Develops sureCore’s New, Ultra-Low Power IoT Reference Platform
Wokingham, UK – 22 May, 2017. Unprecedented growth of over 80% this year has created a further requirement for a major recruitment drive to fuel its continued expansion in the next 12 months and beyond. Already this year, the company’s headcount has increased to over 100.
Wokingham, UK – 25 October 2016. EnSilica opens specialist Design Centre for RF and low power sensing applications based near Oxford. The new facility is headed by Alan Wong, formerly IC Design Director at Frontier Microsystems and extends skill base for wireless connected IoT and wearable products.
Wokingham, UK – 17 August 2016. EnSilica to provide BaySand’s customers with configurable eSi-RISC processor cores, eSi-Connect processor peripherals, eSi-Crypto encryption and eSi-Comms communications IP solutions as well hardware accelerators.
Meet EnSilica at DAC 2016, Austin TX, 6-9 June stand 1742 where we will be demonstrating our latest eSi-RISC processors, the eSi IoT SoC development board as well as our range of IP solutions and IC physical implementation services.
Wokingham, UK – 6th June 2016. EnSilica, a leading independent provider of semiconductor solutions and IP, and Micrium, the premier real-time operating system (RTOS) provider for embedded systems and the Internet of Things (IoT), have partnered to successfully port Micrium’s µC/OS-III® RTOS to EnSilica’s family of eSi-RISC processor cores.
Wokingham, UK – Monday 9th May 2016. EnSilica, a leading independent provider of semiconductor solutions and IP, has launched the eSi-ECDSA cryptographic IP designed to help meet the high security communication and latency requirements of automotive Car2Car and Car2Infrastructure (Car2x) applications that form part of today’s emerging Intelligent Transport Systems.
Increasing demand and continued growth puts EnSilica on recruitment path for engineers; Makes senior level appointments. Mark Hodgkins is appointed as Executive Chairman and David Doyle as Sales Director. EnSilica plans to recruit in excess of 12 additional engineering staff in the UK and 20 in India to support the continued increasing demand for ASIC and FPGA development