September 26, 2024
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SIAE Microelettronica selects EnSilica as key partner to design ASIC for next-generation telecom equipment

SIAE Microelettronica selects EnSilica as key partner to design ASIC for next-generation telecom equipment

SIAE MICROELETTRONICA, a leading provider of innovative microwave radio and wireless network solutions, has selected EnSilica, a leading turnkey supplier of mixed signal ASICs and SoCs, to assist the design of Application-Specific Integrated Circuits (ASICs) for its next-generation telecommunication infrastructure products.

Read the full press release here.

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EnSilica to exhibit at TSMC 2026 NA Technology Symposium in Santa Clara

EnSilica to exhibit at TSMC 2026 NA Technology Symposium in Santa Clara

Join us EnSilica at TSMC 2026 NA Technology Symposium on 22 April! Silicon innovation is expanding AI to ...
EnSilica selected for UK CHERI Adoption Collective

EnSilica selected for UK CHERI Adoption Collective

Part of a leading team of companies to address the UK's  £27bn  cyber resilience problem EnSilica is pleased ...
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