TechWorks/UK Electronic Skills Foundation Electronic Weekly’s BrightSparks Awards The IET Future Talents Scholarship. EnSilica’s Vasiliki Xiradaki was named among the UK’s top 3 student electronic engineers at the annual TechWorks industry awards ceremony on the 7th December. The award category, run and presided over by the UK Electronic Skills Foundation follows hot on the […]
OXFORD, United Kingdom – December 11th 2023 EnSilica (AIM: ENSI), a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), has announced it has entered into a strategic partnership with the design consultancy and custom module developer IndesmaTech. The companies will collaborate to develop custom ASICs for next generation IoT modules and systems […]
When it comes to medical devices, navigating the intricate world of ASICs is something of a tightrope walk. Each step of the design phase involves striking a delicate balance between power, efficiency, and performance, where every gain comes at a cost. Medical ASICs are the beating hearts of potentially life-saving devices that must remain operational […]
Focus on connectivity systems for moving vehicles. Initial applications include commercial and government land-based vehicles EnSilica (AIM: ENSI), a leading turnkey supplier of mixed signal ASICs and SoCs, has announced it is to supply VITES with a new beamformer chip for satellite user terminals. VITES will use the chip at the heart of its […]
Fokus auf breitbandige SATCOM-Datenanbindung während der Fahrt. Erste Anwendungen umfassen kommerzielle Fahrzeuge und solche der Sicherheitsbehörden EnSilica (AIM: ENSI), ein führender Anbieter von Mixed-Signal-ASICs und SoCs, gibt bekannt, die VITES GmbH mit einem neuen Beamforming-Chipsatz (elektronische Funkstrahl-Formung) für Satelliten-User-Terminals zu beliefern. VITES wird die ASIC-Entwicklung maßgeblich begleiten und den Chipsatz in seinen neuen ViSAT-Ka-Band-Terminals […]
