SIAE Microelettronica selects EnSilica as key partner to design ASIC for next-generation telecom equipment

SIAE MICROELETTRONICA, a leading provider of innovative microwave radio and wireless network solutions, has selected EnSilica, a leading turnkey supplier of mixed signal ASICs and SoCs, to assist the design of Application-Specific Integrated Circuits (ASICs) for its next-generation telecommunication infrastructure products.

Read the full press release here.