We are proud to announce that EnSilica has joined the TSMC Design Center Alliance (DCA). This significant achievement underscores our deep expertise in mixed signal and RF design, now combined with TSMC’s advanced technology to deliver unparalleled solutions to our mutual customers.
EnSilica is committed to providing high-performance ASIC solutions across the automotive, industrial, healthcare, and communications sectors using TSMC technologies. Whether you need high-quality full turnkey ASICs or a comprehensive range of services—from PDK access, design support, MPW shuttles, production tape-out, and wafer supply, to packaging, test development, qualification, and supply chain management—we are here to be your trusted IC Partner.
Read the full press release here.