Manufacturing Services
In addition to our core ASIC and Design Services offering we provide comprehensive manufacturing support service to enable our customers’ own design and development activities.
We leverage our excellent technical reputation and strong supplier relationships to deliver comprehensive manufacturing services as a recognized partner of some of the worlds largest Semiconductor Suppliers including TSMC, GF, ASE and many others.
With full access to extensive technology portfolio including advanced TSMC nodes, EnSilica offers competitive tapeout and wafer supply services. These partnerships allows us to provide industry-leading solutions, reinforcing our position as a reliable and innovative partner in the semiconductor industry.
Our comprehensive offering in manufacturing services is based on several key strengths:
- Dedicated Program Management: Each project has an assigned Program Manager.
- Expertise in FinFET Tapeouts: EnSilica has significant experience with multiple FinFET tapeouts. A well-defined process flow, supported by a capable team allows us to resolve even most complex customer issues.
- Global Coverage: Our team is based across US, European, and Asian time zones, ensuring continuous support.
- Long-Term Relationships: EnSilica focuses on building long-term, reliable relationships with clients.
- Full Turnkey Solution: We offer a complete turnkey solution, including process and assembly manufacturing, qualification, production release and sustaining.
- Hybrid Solution Model: EnSilica also provides a hybrid solution model tailored to specific customer requirements.