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Manufacturing Services

In addition to our core ASIC and Design Services offering we provide comprehensive manufacturing support service to enable our customers’ own design and development activities.

We leverage our excellent technical reputation  and strong supplier relationships to deliver comprehensive manufacturing services as a recognized partner of some of the worlds largest Semiconductor Suppliers including TSMC, GF, ASE and many others.

With full access to extensive technology portfolio including advanced TSMC nodes, EnSilica offers competitive tapeout and wafer supply services. These partnerships allows us to provide industry-leading solutions, reinforcing our position as a reliable and innovative partner in the semiconductor industry.

Our comprehensive offering in manufacturing services is based on several key strengths:

  • Dedicated Program Management: Each project has an assigned Program Manager.
  • Expertise in FinFET Tapeouts: EnSilica has significant experience with multiple FinFET tapeouts. A well-defined process flow, supported by a capable team allows us to resolve even most complex customer issues.
  • Global Coverage: Our team is based across US, European, and Asian time zones, ensuring continuous support.
  • Long-Term Relationships: EnSilica focuses on building long-term, reliable relationships with clients.
  • Full Turnkey Solution: We offer a complete turnkey solution, including process and assembly manufacturing, qualification, production release and sustaining.
  • Hybrid Solution Model: EnSilica also provides a hybrid solution model tailored to specific customer requirements.

Foundry Tape out services

At EnSilica, we offer comprehensive manufacturing services that extend beyond design, providing clients with a wide range of foundry options and expert tape-out support.

  • Broad Foundry Access: Our manufacturing capabilities span a diverse range of foundries, ensuring flexibility and adaptability for different client needs.
  • Proven Expertise: With recent tape-outs at industry-leading foundries including TSMC, GlobalFoundries (GF), X-Fab, and Key Foundry, EnSilica’s processes are designed to seamlessly adapt to additional foundries, ensuring reliable results.
  • Comprehensive Technology Coverage: We offer access to the complete foundry technology portfolio, supporting a wide range of process nodes—from 600nm down to advanced 6nm FinFET (6FF) and beyond.
  • End-to-End Tape-Out Support: Our tape-out process involves tailored setup for each technology node, leveraging industry-standard EDA tools to ensure your design complies with foundry-specific rules. EnSilica provides full support throughout the process to ensure smooth and successful project execution

Packaging Design and Manufacture

At EnSilica, our Packaging Development Process is designed to ensure that every solution is tailored to meet the unique needs of each customer, from concept to final product.

  • Customer-Centric Approach: The Packaging Development Process at EnSilica starts with a deep dive into customer requirements. This includes a comprehensive assessment of the application environment, size constraints, lead pitch, relevant industry standards, cost considerations, as well as electrical and thermal performance needs.
  • Tailored Package Selection: Based on these insights, EnSilica collaborates closely with customers to determine the optimal package type. Whether it’s leaded or leadless, flip chip or wire bond, leadframe or substrate-based, or even wafer-level chip scale packaging (WLCSP), the selection is driven by precise application requirements.
  • Rigorous Design and Supplier Selection: A detailed package design specification is then developed, followed by the careful selection of an appropriate package supplier. This step includes a comprehensive package design checklist and a supplier design feasibility study, ensuring all design parameters are thoroughly evaluated and met for successful execution
  • We cooperate with a range of Package Assembly Partners including ASE and Unisem to ensure even the most complex  packaging options can be implemented.

                                                                 

Production Test Development

At EnSilica, production test development is a crucial component of our manufacturing services, meticulously designed to ensure the highest standards of quality and reliability for high-volume semiconductor products.

  • We recognize that every customer may have unique qualification requirements, and we are fully prepared to meet these demands, including strict adherence to industry standards such as AEC-Q100 for automotive-grade products.
  • Our test engineering capabilities form the backbone of this process. We develop customized test software to maximize the efficiency of semiconductor wafer and packaged device testing, ensuring flawless performance across the entire temperature spectrum. This rigorous testing guarantees that every product meets or exceeds required specifications before reaching the market.
  • As part of our end-of-line services, we offer a comprehensive range of final inspection and packaging solutions. These include meticulous visual inspections to detect any defects, tape-and-reel services, and moisture barrier bag (dry-pack) packaging to safeguard products during shipment. We ensure that finished products are delivered safely and efficiently to customers worldwide, maintaining the highest standards of quality and service throughout the entire production cycle

Ensilca can access a range of Test Platforms

Advantest v93k

  • High throughput multi purpose tester (Digital to RF)
  • Targeted for majority of the devices due to high scalability of the platform
  • Tester target for EnSilica to procure

Teradyne Ultraflex

  • High throughput RF Tester with high capability
  • Targeted for complex RF devices with a big demand for resources
  • Test cost is expected to be the highest of 3 platforms

ETS-88

  • Low cost tester for Analog, Digital and Power devices
  • Targeted for simpler devices that is cost driven
  • EnSilica might also procure to consign to subcons

Quality and Reliability

At EnSilica, our commitment to quality is the foundation of everything we do.

We understand that in the semiconductor industry, precision and reliability are non-negotiable. That’s why our manufacturing services are designed with a relentless focus on quality at every stage of the process.

From initial product qualification and environmental testing to the final steps of production, our goal is to ensure that each product not only meets but exceeds industry standards and customer expectations.