In this article for EE Times, Ian Lankshear, CEO of EnSilica, analyses the chronic supply constraints in the 8-inch (200 mm) wafer ecosystem and explains why this reflects structural economics, not just temporary shortages.
He discusses how demand for mixed-signal and power devices at 180 nm/350 nm has outstripped 8-inch capacity, the lack of new 8-inch capital investment, and why migrating designs to 12-inch (300 mm) foundry processes (e.g., 130 nm) can help future-proof supply while offering better integration, yield and long-term cost positioning for OEM ASIC programmes. This article provides useful context for product teams evaluating node migration and supply-chain risk.
Read the full article on EE Times: https://www.eetimes.com/shift-from-8-wafer-fabs-to-12-could-ease-ic-shortages/