In this Electronic Design article, Ian Lankshear ( CEO, EnSilica), explores the economic fundamentals behind choosing a custom ASIC over off-the-shelf components, challenging the perception that ASICs are only feasible for hyperscale tech players.
The piece breaks down cost components such as NRE, tooling, mask sets, and yield, and presents case studies to illustrate the break-even points at which custom ASICs deliver superior value — particularly in IoT, automotive, industrial, and communications applications where advanced process nodes are not always required. This balanced analysis equips engineering and product teams with a clearer understanding of the conditions under which bespoke silicon outperforms standard parts.
Read the article at Electronic Design: https://www.electronicdesign.com/technologies/embedded/digital-ics/article/21983611/the-economics-of-asics-at-what-point-does-a-custom-soc-become-viable
