by annamaria.kelemen@ensilica.com | Oct 30, 2023
Focus on connectivity systems for moving vehicles. Initial applications include commercial and government land-based vehicles EnSilica (AIM: ENSI), a leading turnkey supplier of mixed signal ASICs and SoCs, has announced it is to supply VITES with a new...
by ania.kozlowska@ensilica.com | Apr 13, 2023
EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices Evaluation platform supports wide range of sensors for battery powered medical and fitness devices including ECG, PPG, temperature...
by ania.kozlowska@ensilica.com | Feb 23, 2023
EnSilica to develop satellite communications chip for next generation user terminals Oxford, UK – 17 February 2023 EnSilica (AIM:ENSI), a leading ASIC and mixed signal chip maker, has announced a contract to develop a new chip to address the next generation of mass...
by ania.kozlowska@ensilica.com | Oct 30, 2022
EnSilica has opened a new design centre in Bristol Extends recruitment drive following period of strong growth Oxford, UK – October 26, 2022 EnSilica has today opened a new design centre in Bristol. The office, its fourth in the UK, will open with a staff of 14...
by annamaria.kelemen@ensilica.com | Oct 17, 2022
Strong operational and financial performance with significant market growth potential OXFORD, United Kingdom EnSilica (AIM: ENSI), a leading mixed signal chipmaker announces full year results for the year ended 31 May 2022 (“FY 22”). Financial...
