EnSilica & IndesmaTech Partner for IoT ASICs

EnSilica & IndesmaTech Partner for IoT ASICs

OXFORD, United Kingdom – December 11th 2023  EnSilica (AIM: ENSI), a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), has announced it has entered into a strategic partnership with the design consultancy and custom module...
EnSilica Supplies Beamforming ICs to Vites

EnSilica Supplies Beamforming ICs to Vites

Focus on connectivity systems for moving vehicles. Initial applications include commercial and government land-based vehicles EnSilica (AIM: ENSI), a leading turnkey supplier of mixed signal ASICs and SoCs, has announced it is to supply VITES with a new...
EnSilica Platform Speeds Wearable Sensor Development

EnSilica Platform Speeds Wearable Sensor Development

EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices Evaluation platform supports wide range of sensors for battery powered medical and fitness devices including ECG, PPG, temperature...
ESA & UK Back EnSilica Satellite Broadband Chip

ESA & UK Back EnSilica Satellite Broadband Chip

EnSilica to develop satellite communications chip for next generation user terminals Oxford, UK – 17 February 2023 EnSilica (AIM:ENSI), a leading ASIC and mixed signal chip maker, has announced a contract to develop a new chip to address the next generation of mass...