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EnSilica joins TSMC Design Center Alliance

EnSilica joins TSMC Design Center Alliance

by annamaria.kelemen@ensilica.com | Sep 19, 2024

We are proud to announce that EnSilica has joined the TSMC Design Center Alliance (DCA). This significant achievement underscores our deep expertise in mixed signal and RF design, now combined with TSMC’s advanced technology to deliver unparalleled solutions to...
EnSilica adds Post Quantum Cryptography support to eSi-Crypto IP library

EnSilica adds Post Quantum Cryptography support to eSi-Crypto IP library

by annamaria.kelemen@ensilica.com | Jan 15, 2024

First license for EnSIlica’s PQC cores licensed to major semiconductor vendor for 5nm networking chip OXFORD, United Kingdom – January 15th 2024 EnSilica (AIM: ENSI), a leading chip maker of mixed-signal ASICs, has added a range of Post-Quantum Cryptography (PQC)...
EnSilica’s Vasiliki Xiradaki named among UK’s best young engineers in a trio of prestigious industry awards

EnSilica’s Vasiliki Xiradaki named among UK’s best young engineers in a trio of prestigious industry awards

by annamaria.kelemen@ensilica.com | Dec 12, 2023

TechWorks/UK Electronic Skills Foundation Electronic Weekly’s BrightSparks Awards The IET Future Talents Scholarship. EnSilica’s Vasiliki Xiradaki was named among the UK’s top 3 student electronic engineers at the annual TechWorks industry awards  ceremony on the...
EnSilica enters strategic partnership with Indesmatech to develop custom ASIC’s for IoT modules and Components

EnSilica enters strategic partnership with Indesmatech to develop custom ASIC’s for IoT modules and Components

by annamaria.kelemen@ensilica.com | Dec 11, 2023

OXFORD, United Kingdom – December 11th 2023  EnSilica (AIM: ENSI), a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), has announced it has entered into a strategic partnership with the design consultancy and custom module...
EnSilica und VITES kooperieren bei der Chipsatz-Entwicklung zur Realisierung energie- und kosteneffizienter Flat-Panel-Terminals für NGSO-Konstellationen

EnSilica und VITES kooperieren bei der Chipsatz-Entwicklung zur Realisierung energie- und kosteneffizienter Flat-Panel-Terminals für NGSO-Konstellationen

by annamaria.kelemen@ensilica.com | Oct 30, 2023

Fokus auf breitbandige SATCOM-Datenanbindung während der Fahrt. Erste Anwendungen umfassen kommerzielle Fahrzeuge und solche der Sicherheitsbehörden EnSilica (AIM: ENSI), ein führender Anbieter von Mixed-Signal-ASICs und SoCs, gibt bekannt,...
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