by annamaria.kelemen@ensilica.com | Mar 5, 2025
In partnership with the European Space Agency (ESA), EnSilica, a leading maker of mixed-signal ASICs, will design and develop a key silicon component to enable next-generation resilient multi-band Global Navigation Satellite System (“GNSS”) capabilities. These are...
by annamaria.kelemen@ensilica.com | Feb 3, 2025
EnSilica (AIM: ENSI), a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), announces that it has been awarded funding from the UK Space Agency under its Connectivity in Low-Earth Orbit (“C-LEO”) programme. Following a competitive...
by annamaria.kelemen@ensilica.com | Jan 9, 2025
Oxford, United Kingdom EnSilica, a leading maker of mixed-signal ASICs (Application Specific Integrated Circuits), has developed a combined hardware IP block supporting the full CRYSTALS post-quantum cryptography (PQC) suite, saving silicon area, power and cost. The...
by annamaria.kelemen@ensilica.com | Sep 26, 2024
SIAE MICROELETTRONICA, a leading provider of innovative microwave radio and wireless network solutions, has selected EnSilica, a leading turnkey supplier of mixed signal ASICs and SoCs, to assist the design of Application-Specific Integrated Circuits (ASICs) for its...
by annamaria.kelemen@ensilica.com | Sep 24, 2024
We are pleased to announce that EnSilica and Omni Design Technologies, Inc. are partnering to address ASICs for advanced wireless communications and digital beamformer applications.This is an expansion of a proven partnership between the 2...
