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EnSilica expands partnership with Omni Design Technologies
We are pleased to announce that EnSilica and Omni Design Technologies, Inc. are partnering to ...
EnSilica joins TSMC Design Center Alliance
We are proud to announce that EnSilica has joined the TSMC Design Center Alliance (DCA). This significant ...
Select the Right Microcontroller IP for Your High-Integrity SoCs — Electronic Design
“Select the Right Microcontroller IP for Your High-Integrity SoCs” — Electronic Design (25 June 2024) This ...
MIMO Needs FinFET: Key Changes for Analog Designers — Microwave Journal
In this Microwave Journal technical article, Gabriele Devita (EnSilica) explains why the transition to FinFET ...
ASICs Bring Back Control to Supply Chains — EETimes
In this article Ian Lankshear (CEO, EnSilica) argues that the semiconductor supply-chain disruptions seen during ...
EnSilica adds Post Quantum Cryptography support to eSi-Crypto IP library
First license for EnSIlica’s PQC cores licensed to major semiconductor vendor for 5nm networking chip
OXFORD, ...
EnSilica’s Vasiliki Xiradaki named among UK’s best young engineers in a trio of prestigious industry awards
TechWorks/UK Electronic Skills Foundation
Electronic Weekly’s BrightSparks Awards
The IET Future Talents ...
EnSilica enters strategic partnership with Indesmatech to develop custom ASIC’s for IoT modules and Components
OXFORD, United Kingdom – December 11th 2023
EnSilica (AIM: ENSI), a leading chip maker of mixed ...
EnSilica und VITES kooperieren bei der Chipsatz-Entwicklung zur Realisierung energie- und kosteneffizienter Flat-Panel-Terminals für NGSO-Konstellationen
Fokus auf breitbandige SATCOM-Datenanbindung während der Fahrt. Erste Anwendungen umfassen kommerzielle Fahrzeuge ...
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