3 June 2015 – The annual Design Automation Conference is one of the industry’s premier events and EnSilica will be exhibiting for the fifth successive year. For those who are attending, do drop by our stand (2228) where we will be showcasing some of our customers products based on EnSilica IP. We can also provide an update on the expansion of our ASIC development, IP and design services offerings.
8 May 2015 – The solution developed by EnSilica, with its excellent features, has enhanced greatly the functionality of our product. We look forward to joining hands again with the team to develop more high-performance IC solutions …
8 May 2015 Semisens reduce the die size and lower the power consumption of their touch screen controllers using EnSilica’s IPs. The Semisens devices are now successfully released to the market and customer benchmarking showed that the touch controller consumed the lowest power among touch controllers available in the market. In addition to the value of the EnSilica CPU core, EnSilica’s IP provides ease of integration and verification with other logic blocks.
