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London Stock Exchange welcomes EnSilica plc to AIM

EnSilica is a designer and supplier of mixed signal ASICs (Application Specific Integrated Circuit). ASICs are Integrated Circuits or semiconductor chips developed for a particular use or product rather than for general purpose usage.  ASICs help differentiate products through optimised hardware making products smaller, faster, lower power, improved security, add novel functionality, improving supply chain security and protecting product from being copied.

 

The Company has expertise in the area of designing complex mixed signal ASICs. Mixed signal ASICs combine digital and analogue functions onto a single chip. They are the most complex chips to design hence the highest value.

The Company was established in 2001 as a specialist consultancy designing ICs on a contract basis. Using over 15 years’ first-hand industry experience, the Company was able to begin transitioning to a fabless design and supply business model in 2016. EnSilica now provides an end-to-end service for the design and supply of ASICs, outsourcing certain elements such as the wafer fabrication of the manufacturing and packaging to third parties – otherwise known as a Fabless Semiconductor Model. This is a proven model for growth and profitability used by many European companies including Dialog Semiconductor, Cambridge Silicon Radio, Wolfson and Nordic Semiconductor.

EnSilica’s customers currently range from global corporations and OEMs to technology start-ups, including automotive Tier 1s, industrial enterprises, as well as large software companies and service providers developing proprietary hardware.  EnSilica is an approved supplier to some of the world’s largest automotive and industrial OEMs and Tier 1 suppliers.

Transaction Details

EnSilica, a leading designer and supplier of mixed signal ASICs (Application Specific Integrated Circuit), is pleased to announce its admission to trading on the AIM market of the London Stock Exchange. Dealings on AIM are expected to commence at 8.00 a.m. on 24 May 2022, under the ticker ENSI and ISIN GB00BN7F1618.

In connection with Admission, EnSilica has raised £6 million through a placing and subscription of 12,000,000 Ordinary Shares at a price of 50p per share and will have a market capitalisation of approximately £37.6 million at the Placing Price.

The Directors believe that the Group has reached a stage in its development where it will benefit from a quotation on AIM and that, as well as providing the Company with the net proceeds of the Fundraising, this will:

  • enhance both transparency and international profile of EnSilica with existing and potential customers;
  • allow the Company to access equity capital creating flexibility to fund growth and support potential M&A opportunities;
  • enable EnSilica to attract, recruit and retain key employees who may be further incentivised through share option schemes ; and
  • create a platform for existing shareholders to participate in the future growth of the Company

Ian Lankshear, Chief Executive Officer of EnSilica commented:

“We are delighted to be floating EnSilica on AIM and believe this represents a major endorsement of our business.  Our quoted status will provide an ideal platform from which to accelerate a number of growth initiatives which will ultimately further expand both market reach and customer footprint.

Having developed a reputation of excellence and innovation over the past 21 years, we firmly believe our mixed signal and RF design and supply capabilities are ideally placed to further capitalise on the significant demand for ASICs across our key markets.

We are excited by the numerous opportunities that being a quoted company will bring and we look forward to further developing EnSilica over the coming years.”

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EnSilica to list on London Stock Exchange’s AIM market, expected to begin trading from 24th May

OXFORD, United Kingdom –May 19, 2022EnSilica, the UK-headquartered specialist designer and supplier of mixed signal ASICs has announced it is set to be listed on the London Stock Exchange’s AIM market. Trading is expected to begin from the 24th May under the ticker ENSI.

AIM is the LSE’s market for small and medium sized growth companies, with over 1,200 companies listed on it.

In connection with the Admission, EnSilica has raised £6 million (USD 7.4m) through a placing and subscription of 12,000,000 Ordinary Shares at a price of 50p per share and will open with a market capitalisation of £37.6 million (USD 46.6m).

The company designs ASICs for system developers working across the automotive, satellite and healthcare sectors. Its CEO, Ian Lankshear said “Our quoted status will provide an ideal platform from which to accelerate a number of growth initiatives, which will ultimately further expand both market reach and customer footprint.

“Having developed a reputation of excellence and innovation over the past 21 years, we firmly believe our mixed signal and RF design and supply capabilities are ideally placed to further capitalise on the significant demand for ASICs across our key markets.”

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EnSilica shortlisted for three UK TechWorks Awards

The votes are in for this year’s Electronics Weekly Elektra Awards and after another record-breaking year for entries EnSilica is proud to have its eSi-ADAS Radar Co-Processor nominated as a finalist in the “Excellence in Design” category.

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EnSilica are Recruiting !

EnSilica are recruiting ! Due to our continuing growth– particularly in the area of mixed-signal ASIC development, we have a number of exciting opportunities at our UK design centres in Wokingham and Bristol.

EnSilica announce new sales partnership with Beyond Electronics, Israel

EnSilica have announced a new sales partnership with Beyond Electronics in Israel to  to help grow its customer footprint within the region.Beyond_electronics

Beyond will be offering the full range of EnSilica IPs to customers within Israel including eSi-RISC (16/32 bit embedded processor) , eSi-Crypto, eSi-Comms and eSi-Connect IPs. Beyond will also help EnSilica to expand its design service activities within the country.

“EnSilica has been highly successful in selling its IP across a number of countries over the past few years and by partnering with Beyond Electronics we are looking to replicate that same success within the Israeli market.  Beyond Electronics work with many of the most exciting and innovative companies within the country and we look forward to helping those customers achieve even more success through the adoption of EnSilica IP and services” said Ian Lankshear, Managing Director of EnSilica.

Yossi Benizri, CEO of Beyond Electronics said  “EnSilica is an ambitious company, and a leader in the Processor IP Market  and we are extremely pleased they have chosen to partner with us to create a stronger presence in Israel”

About Beyond Electronics :

Beyond Electronics is a Technical sales representative company serving the semiconductor market in Israel and Europe. Our line card consists of a focused group of industry-leading suppliers supporting the  semiconductor market.

Founded in 2012, Beyond Electronics has been rapidly expanding and already recognized as a core partner by most of the OEM’s, IDMs & fabless firms in the region.

Beyond have deployed a team of strong technical sales and application professionals who possess the requisite skills and background to forge long-term partnerships between customers and suppliers.

For further information, visit http://www.beyond-electronics.com/

About EnSilica: 

EnSilica was founded in 2001 and has a strong track record of success in delivering semiconductor IP and providing ASIC and FPGA design services to semiconductor companies and OEMs worldwide. The company is a specialist in low-power ASIC design and complex FPGA-based embedded systems, including hardware and embedded software development.

Our portfolio of IP includes eSi-RISC, a highly configurable 16/32 bit embedded processor, and families of IP covering communications, processor peripherals and encryption. In addition to providing IP and turnkey ASIC and FPGA development, EnSilica also provides point services to companies with in-house ASIC and FPGA design teams. These services include system engineering, analog and mixed signal design, advanced verification using UVM, DFT and physical implementation.

The company is headquartered in the UK and has offices in India and the USA.

For further information about EnSilica, visit https://ensilica.com

 

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