Come and meet EnSilica at MWC 2016 in Hall 7, UK Pavilion, stand 7C70k.

EnSilica will be demonstrating their eSi IoT SoC development board based around the Altera MAX10 FPGA and the eSi-RISC low-power processor IP. It provides a highly flexible IoT development platform which can be cost optimized and integrated into a System in Package (SiP) or System on Chip (SoC).

iot-demo-board-fullThe IoT board includes the following features:

  • Altera MAX10 FPGA
  • Bluetooth Smart and NFC connectivity
  • GPS with built in antenna
  • 9-axis motion, temperature, humidity , light sensors
  • Buzzer and digital microphone
  • Capacitive touch button

The company will also be demonstrating its portfolio of IP solutions, including eSi-RISC, a highly configurable 16/32 bit embedded processor, alongside IP for communications, processor peripherals and encryption.

EnSilica founded in 2001 has a strong track record of success in delivering ASIC and FPGA based solution to semiconductor companies and OEMs worldwide. The company is headquartered in the UK and has offices in India and the USA.  Specialist in low-power ASIC design and complex FPGA-based embedded systems. EnSilica provide full turnkey ASIC development and supply of mixed signal and digital ASIC from 180nm to 28nm for mobile, IoT, smart sensing and industrial applications.

MWC 2016

Mobile World Congress is the world’s largest gathering for the mobile industry, organised by the GSMA, & held in the Mobile World Capital Barcelona, 22-25 February 2016.

Please book a slot to meet Ian Lankshear our CEO using the My MWC Application Networking feature, call +34606918111 or email