Ensilica @ Mobile World Congress 2017
Mobile World Congress is the world’s largest gathering for the mobile industry, organised by the GSMA and held in the Mobile World Capital Barcelona, 27 February – 2 March 2017 and EnSilica will be there in Hall 7, Stand 7B15
If you are attending, do drop by to discover how our latest IC and System design and supply capabilities and full range of advanced IP solutions can help you bring you products to market quickly and cost-effectively.
- New range of eSi-RISC processors
- IoT reference platforms
- Comprehensive IC design & supply services
- Analog and Mixed Signal IC design
- IC physical implementation services
- IP for Advanced Driver Assist Systems (ADAS), communications, peripherals and encryption.
If you would like to reserve a time to meet our team please contact us.
- Hall 7, Stand 7B15
- Call: +44 (0) 118 3217 310
- email: info@ensilica.com
