Ensilica @ Mobile World Congress 2017

mwc-logoMobile World Congress is the world’s largest gathering for the mobile industry, organised by the GSMA and held in the Mobile World Capital Barcelona, 27 February – 2 March 2017 and EnSilica will be there in Hall 7, Stand 7B15

If you are attending, do drop by to discover how our latest IC and System design and supply capabilities and full range of advanced IP solutions can help you bring you products to market quickly and cost-effectively.

If you would like to reserve a time to meet our team please contact us.