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EnSilica @ Cambridge Wireless International Conference 2020

The world is at the edge of great change, with new technologies offering radically different operating models to businesses. Edge Computing, which promises all the benefits of supercomputing but without the latency, is one such innovation which, especially when combined with its enabling partners 5G, AI and IoT, cannot be ignored.

The Cambridge Wireless International Conference is the flagship event for Cambridge’s world-renowned technology community. It attracts companies from across the world who want to learn from and do business with the UK’s most innovative city.

The Virtual exhibition will be on Tuesday, 22 September 2020

eSi-MediSense: Customisable ASIC Platform

The eSi-MediSense is a customizable ASIC platform for ultra-low-power wireless vital signs and medical monitoring products. This versatile platform allows for fast time to market of medical and healthcare sensor wearables requiring sub-GHz ISM-band, BLE and/or NFC wireless connectivity. A high-performance configurable processor provides on-chip pre-processing of the sensor data with an optional machine learning accelerator providing the capability of performing AI at the edge.

The platform supports the accurate and reliable measurement of ECG, heart rate, respiration rate, and temperature. A flexible interface is also provided for electro chemical-based measurement such as amperometric, voltammetric or impedance measurements.

nb iot block diagram
Platform Fact Sheet

EnSilica selected for automotive Chassis ASIC socket

“EnSilica is one of Europe’s leading companies in the field of custom mixed signal and digital ASIC design and this design win to develop a complex ASIC for a Tier‐1 automotive supplier and our partnership with RoodMicrotec recognises our unique capabilities.”  Ian Lankshear, CEO of EnSilica.  Read more

Benefits of Custom ASIC solutions

Automotive Industry is integrating a range of discrete components along, including a CPU, into a chip, to create smaller, more reliable, lower-cost products. Using EnSilica’s end-to-end design and supply service means that the benefits of custom chips are now within easy reach of most companies.

  • Reduced BOM
  • Lower power consumption
  • Smaller size
  • Greater functionality
  • Supply chain protection and simplification
  • IP security
  • Increased reliability

eSi-NB-IOT: Smart Sensor ASIC Platform

Highly integrated, specialised sensors with a low power NB-IoT modem for remote monitoring and control

The eSi-NB-IOT-Sensor is a customisable SoC platform delivering a fully integrated NarrowBand-Internet of Things solution that is compliant with the 3GPP Release 14/15 Cat NB2 standard. The modem is based on the market leading CEVA Dragonfly NB2 solution with an optionally integrated GNSS capability.

nb iot block diagram
Platform Fact Sheet

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