Planning for Embedded World 2025
Embedded World 2025 is still few months ahead but we’ve already started preparations for our presence at this great event. More details to follow soon…
This author has not written his bio yet.
But we are proud to say that Ania Kozlowska contributed 14 entries already.
Embedded World 2025 is still few months ahead but we’ve already started preparations for our presence at this great event. More details to follow soon…
We are excited to announce that EnSilica will be exhibiting at Electronica 2024, the world’s leading trade fair for electronics. This prestigious event will take place from November 12-15, 2024, in Munich, Germany. Join us at our booth C5.168 to explore our latest innovations in ASIC design and semiconductor solutions. Our team of experts […]
While healthcare may have lagged behind sectors like fintech or education, its digital transformation in recent years has been nothing short of seismic. New technologies as well as social and environmental challenges have propelled the industry forward, from the emergence of telehealth and virtual appointments, to machine learning (ML) powered diagnostics and remote patient […]
In the dynamic landscape of wireless communication, semiconductor innovations play a pivotal role. Among these, FinFET technology stands out as a game-changer. Let’s explore how FinFETs are shaping the future of 5G and satellite communication. MIMO Systems: A Brief Overview Deployment of 5G terrestrial and satellite communications relies heavily on the integration of Multiple-Input, Multiple-Output […]
Back in 2019 we looked at the California disengagement data as part of look at the challenge self-driving cars faced over the coming years. There was a lot of variation in success with Google’s Waymo (please excuse the pun) way out in front with 11,018 miles on average per disengagement (ie the test driver grabbing […]
In the second part of our series on designing ASICs for space applications, we build upon the foundational understanding of the environmental challenges and initial mitigation strategies outlined in part one. In this article, we shift our focus toward advanced mitigation techniques, particularly emphasizing the intricacies of RF ASICs, which play a pivotal role in […]
Here EnSilica’s Konstantinos Glaros examines some key tradeoffs OEMs will likely face when taking an ASIC approach and how to balance these tradeoffs more effectively. Wearable technology for healthcare and wellness applications represents a tremendous opportunity. The potential designs range from smart plasters through wrist monitors to therapeutic systems. But a common set […]
First license for EnSIlica’s PQC cores licensed to major semiconductor vendor for 5nm networking chip OXFORD, United Kingdom – January 15th 2024 – EnSilica (AIM: ENSI), a leading chip maker of mixed-signal ASICs, has added a range of Post-Quantum Cryptography (PQC) accelerators to its eSi-Crypto range of hardware accelerator IP. These cryptographic algorithms are developed […]
In the first installment of this two-part blog series on space-based ASICs, we delve into the intricate challenges of designing ASICs for the demanding environment of space. The stakes are high; launching and maintaining satellite equipment in orbit is a costly endeavor, so ensuring the effectiveness and reliability of integral components is paramount. In […]
TechWorks/UK Electronic Skills Foundation Electronic Weekly’s BrightSparks Awards The IET Future Talents Scholarship. EnSilica’s Vasiliki Xiradaki was named among the UK’s top 3 student electronic engineers at the annual TechWorks industry awards ceremony on the 7th December. The award category, run and presided over by the UK Electronic Skills Foundation follows hot on the […]
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