Oxford, UK EnSilica, a leading chip maker of mixed signal ASICs (“Application Specific Integrated Circuits”), is pleased to announce that it has been awarded an $18m design and supply contract by a leading European based supplier of electromechanical products for a Cortex M series Arm-based mixed signal sensor interface ASIC to be used across a […]
Oxford, UK EnSilica, a leading maker of mixed-signal ASICs, has opened a second design centre in Brazil after a series of design wins, the most recent being a multimillion-pound design and manufacturing contract from an optical computing systems customer. The new design centre is in Campinas, São Paulo State, and complements the company’s Porto […]
In partnership with the European Space Agency (ESA), EnSilica, a leading maker of mixed-signal ASICs, will design and develop a key silicon component to enable next-generation resilient multi-band Global Navigation Satellite System (“GNSS”) capabilities. These are vital to ensuring the world’s critical infrastructure and services remain robust and secure in the face of evolving global […]
EnSilica (AIM: ENSI), a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), announces that it has been awarded funding from the UK Space Agency under its Connectivity in Low-Earth Orbit (“C-LEO”) programme. Following a competitive selection process, EnSilica has been awarded £10.38 million over the next three-years for a development project pioneered […]
We are very excited to announce our participation in Satellite Show 2025 in Washington DC ! 🛰️ SATELLITE Conference & Exhibition Join us at: Hall A, Stand 2754, Walter E. Washington Convention Center, Washington, D.C. 📅 11 to 13 March, 2025 Visit our stand to chat with our leadership team and gain insights into our […]
We are pleased to share that EnSilica has been awarded a new ASIC supply contract for an industrial timing controller ASIC. Our selection by this leading industrial test equipment provider underscores our world-class expertise in mixed-signal design and our expanding intellectual property portfolio, helping reduce our customers’ time to market. We are proud to be […]
SIAE MICROELETTRONICA, a leading provider of innovative microwave radio and wireless network solutions, has selected EnSilica, a leading turnkey supplier of mixed signal ASICs and SoCs, to assist the design of Application-Specific Integrated Circuits (ASICs) for its next-generation telecommunication infrastructure products. Read the full press release here.
We are pleased to announce that EnSilica and Omni Design Technologies, Inc. are partnering to address ASICs for advanced wireless communications and digital beamformer applications. This is an expansion of a proven partnership between the 2 companies and an important step in delivering innovative advanced solutions to our customers. 📣 Read the full press release […]
We are proud to announce that EnSilica has joined the TSMC Design Center Alliance (DCA). This significant achievement underscores our deep expertise in mixed signal and RF design, now combined with TSMC’s advanced technology to deliver unparalleled solutions to our mutual customers. EnSilica is committed to providing high-performance ASIC solutions across the automotive, industrial, healthcare, […]
By Enrique Martinez-Asensio, Functional Safety Manager in Silicon Characterization at EnSilica High integrity/reliability electronic systems (hi-rel) refer to applications where failures are simply not an option. Industries that fit this category include automotive, aerospace, medical, and manufacturing, where reliability and safety functions are not just critical, but mandated through various regulatory standards. Many of these […]
