We are very excited to announce our participation in Satellite Show 2025 in Washington DC ! 🛰️ SATELLITE Conference & Exhibition Join us at: Hall A, Stand 2754, Walter E. Washington Convention Center, Washington, D.C. 📅 11 to 13 March, 2025 Visit our stand to chat with our leadership team and gain insights into our […]
We are pleased to share that EnSilica has been awarded a new ASIC supply contract for an industrial timing controller ASIC. Our selection by this leading industrial test equipment provider underscores our world-class expertise in mixed-signal design and our expanding intellectual property portfolio, helping reduce our customers’ time to market. We are proud to be […]
SIAE MICROELETTRONICA, a leading provider of innovative microwave radio and wireless network solutions, has selected EnSilica, a leading turnkey supplier of mixed signal ASICs and SoCs, to assist the design of Application-Specific Integrated Circuits (ASICs) for its next-generation telecommunication infrastructure products. Read the full press release here.
We are pleased to announce that EnSilica and Omni Design Technologies, Inc. are partnering to address ASICs for advanced wireless communications and digital beamformer applications. This is an expansion of a proven partnership between the 2 companies and an important step in delivering innovative advanced solutions to our customers. 📣 Read the full press release […]
We are proud to announce that EnSilica has joined the TSMC Design Center Alliance (DCA). This significant achievement underscores our deep expertise in mixed signal and RF design, now combined with TSMC’s advanced technology to deliver unparalleled solutions to our mutual customers. EnSilica is committed to providing high-performance ASIC solutions across the automotive, industrial, healthcare, […]
By Enrique Martinez-Asensio, Functional Safety Manager in Silicon Characterization at EnSilica High integrity/reliability electronic systems (hi-rel) refer to applications where failures are simply not an option. Industries that fit this category include automotive, aerospace, medical, and manufacturing, where reliability and safety functions are not just critical, but mandated through various regulatory standards. Many of these […]
We are thrilled to announce our participation in Embedded World 2025! Join us: 📍 Halle 4, Stand 559, Messe Nuremberg 📅 11 to 13 March, 2025 Visit our stand to chat with our leadership team and gain insights into how EnSilica is driving advancements in ASIC and semiconductor solutions. Let’s connect, collaborate, and innovate together!
We are excited to announce that EnSilica will be exhibiting at Electronica 2024, the world’s leading trade fair for electronics. This prestigious event will take place from November 12-15, 2024, in Munich, Germany. Join us at our booth C5.168 to explore our latest innovations in ASIC design and semiconductor solutions. Our team of experts […]
While healthcare may have lagged behind sectors like fintech or education, its digital transformation in recent years has been nothing short of seismic. New technologies as well as social and environmental challenges have propelled the industry forward, from the emergence of telehealth and virtual appointments, to machine learning (ML) powered diagnostics and remote patient […]
In the dynamic landscape of wireless communication, semiconductor innovations play a pivotal role. Among these, FinFET technology stands out as a game-changer. Let’s explore how FinFETs are shaping the future of 5G and satellite communication. MIMO Systems: A Brief Overview Deployment of 5G terrestrial and satellite communications relies heavily on the integration of Multiple-Input, Multiple-Output […]
