About Ania Kozlowska

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Entries by Ania Kozlowska

Advanced Strategies for RF ASICs in Space: Ensuring Functionality and Safety

In the second part of our series on designing ASICs for space applications, we build upon the foundational understanding of the environmental challenges and initial mitigation strategies outlined in part one. In this article, we shift our focus toward advanced mitigation techniques, particularly emphasizing the intricacies of RF ASICs, which play a pivotal role in […]

Managing tradeoffs in ASIC design for low-power, small-form-factor wearable medical devices

    Here EnSilica’s Konstantinos Glaros examines some key tradeoffs OEMs will likely face  when taking an ASIC approach and how to balance these tradeoffs more effectively. Wearable technology for healthcare and wellness applications represents a tremendous opportunity. The potential designs range from smart plasters through wrist monitors to therapeutic systems. But a common set […]

EnSilica adds Post Quantum Cryptography support to eSi-Crypto IP library

First license for EnSIlica’s PQC cores licensed to major semiconductor vendor for 5nm networking chip OXFORD, United Kingdom – January 15th 2024 – EnSilica (AIM: ENSI), a leading chip maker of mixed-signal ASICs, has added a range of Post-Quantum Cryptography (PQC) accelerators to its eSi-Crypto range of hardware accelerator IP. These cryptographic algorithms are developed […]

EnSilica’s Vasiliki Xiradaki named among UK’s best young engineers in a trio of prestigious industry awards

TechWorks/UK Electronic Skills Foundation Electronic Weekly’s BrightSparks Awards The IET Future Talents Scholarship.   EnSilica’s Vasiliki Xiradaki was named among the UK’s top 3 student electronic engineers at the annual TechWorks industry awards  ceremony on the 7th December. The award category, run and presided over by the UK Electronic Skills Foundation follows hot on the […]

EnSilica enters strategic partnership with Indesmatech to develop custom ASIC’s for IoT modules and Components .

OXFORD, United Kingdom – December 11th 2023  EnSilica (AIM: ENSI), a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), has announced it has entered into a strategic partnership with the design consultancy and custom module developer IndesmaTech.   The companies will collaborate to develop custom ASICs for next generation IoT modules and systems […]

Medical ASICs: Balancing Power and Performance in Wearable Technologies

When it comes to medical devices, navigating the intricate world of ASICs is something of a tightrope walk. Each step of the design phase involves striking a delicate balance between power, efficiency, and performance, where every gain comes at a cost. Medical ASICs are the beating hearts of potentially life-saving devices that must remain operational […]

EnSilica to supply beamforming SatCom ICs to Germany’s VITES to enable power- and cost-efficient flat panel terminals for NGSO-constellations

Focus on connectivity systems for moving vehicles. Initial applications include commercial and government land-based vehicles    EnSilica (AIM: ENSI), a leading turnkey supplier of mixed signal ASICs and SoCs, has announced it is to supply VITES with a new beamformer chip for satellite user terminals. VITES will use the chip at the heart of its […]

EnSilica und VITES kooperieren bei der Chipsatz-Entwicklung zur Realisierung energie- und kosteneffizienter Flat-Panel-Terminals für NGSO-Konstellationen

Fokus auf breitbandige SATCOM-Datenanbindung während der Fahrt. Erste Anwendungen umfassen kommerzielle Fahrzeuge und solche der Sicherheitsbehörden    EnSilica (AIM: ENSI), ein führender Anbieter von Mixed-Signal-ASICs und SoCs, gibt bekannt, die VITES GmbH mit einem neuen Beamforming-Chipsatz (elektronische Funkstrahl-Formung) für Satelliten-User-Terminals zu beliefern. VITES wird die ASIC-Entwicklung maßgeblich begleiten und den Chipsatz in seinen neuen ViSAT-Ka-Band-Terminals […]