Multi-Core AI Edge Processor
A multi-core audio DSP development for a consumer application including a feasibility phase, then RTL-to-GDSII implementation to tape-out.
Entries by James Wilkins
EnSilica chassis control ASIC for premium automotive brand enters mass production
2.5 million mixed-signal ASICs to be produced in 1st year OXFORD, United Kingdom – EnSilica (LON: ENSI), a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), has announced the development of a custom chassis-control ASIC, which has entered mass production, and will appear in vehicles later this year. The device will […]
EnSilica @ Medical Wearables 2020
Dec 8-10, 2020:Join us at the 5th annual conference and exhibition on medical wearables.
EnSilica @ D&R’s IP-SoC Conference 2020
Dec 8-9, 2020:Join us at D&R’s IPSoC Conference 2020, the 23rd running of this Silicon IP event.
EnSilica @ SEMISRAEL EXPO 2021
Spring 2021:Join us at the premier professional semiconductor event in Israel.
How to Write an ASIC Specification
EnSilica release technical guide to writing an ASIC specification: “Tell me what you want, what you really really want”.
Customisable wireless medical sensor chip with machine learning accelerator enables mass market advanced medical and vital-sign monitors
EnSilica’s customisable eSi-MediSense chip with ML accelerator enables advanced medical monitors.
Agile Analog and EnSilica Collaborate to Improve Quality and Reliability of Microchips
Agile Analog and EnSilica collaborate to improve the quality and reliability of microchips.
EnSilica to Develop Next-Generation Ka Band Satellite Transceivers for the European Space Agency
EnSilica to develop next-generation Ka band satellite transceivers for the European Space Agency.
EnSilica @ Embedded World 2020
25 – 27 February 2020
Nuremberg, Germany | Hall 4, Stand 4-441
