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EnSilica to supply beamforming SatCom ICs to Germany’s VITES to enable power- and cost-efficient flat panel terminals for NGSO-constellations

Focus on connectivity systems for moving vehicles. Initial applications include commercial and government land-based vehicles

  

EnSilica (AIM: ENSI), a leading turnkey supplier of mixed signal ASICs and SoCs, has announced it is to supply VITES with a new beamformer chip for satellite user terminals. VITES will use the chip at the heart of its new ViSAT-Ka-band terminal.

EnSilica’s beam-forming chip is optimised to enable VITES’s creation of power- and cost-efficient ground-based flat panel user terminals for satellite communication systems that can be used across a range of fixed and SatCom on the move (SOTM) applications.VITES specialises in broadband wireless systems for professional applications and has been delivering flat panel terminals based on its own phased array technology since 2019.

Its new ViSAT-Ka-band terminal is intended to be integrated into vehicles for Communications-on-the Move applications. As such it is able to track the movement of low earth orbit (LEO) and other non geo synchronous (NGSO) satellites and allows users to access high-speed connectivity anywhere on the planet while the vehicle is moving.

ViSAT-Ka uses an innovative scalable architecture that enables extremely power efficient TDD and FDD terminals at affordable prices. On this advanced technical base, VITES is developing terminals for both land-based and maritime vehicles of any kind, including for cost and power sensitive automotive applications.

This means that vehicles can access “Always on” broadband connections outside of 4G / 5G network coverage areas, with high throughput, and in an ultra-compact form factor that allows for both retro and line fitting.

Paul Morris, VP of the RF and communications business unit at EnSilica commented:

“EnSilica has been investing in this area for several years working closely with the UK Space Agency, European Space Agency and VITES GmbH. VITES have provided clear terminal requirements so we have been able to optimise our solution for the market. This beamformer chip can be paired with a range of Ka- and Ku-band RFICs including our own EN92030 allowing it to cover the various LEO or GEO constellations. “ 

Martin Gassner, CEO of VITES said:

“For the upcoming NGSO-constellations, quantum leap solutions are required in order to drive performance up, while driving cost and power consumption down. Our new ViSAT-Ka-Band terminals are the solution to these challenges. We’re delighted to be partnering with EnSilica and working closely with them on leading SOTM solutions that are delivering broadband connectivity even when there is no access to terrestrial networks.”

 

 Fig 1) The ViSAT-Ka-band terminal is intended to be integrated into vehicles for Communications-on-the Move.

       

Fig 2) Map showing 4G and 5G coverage in US and Germany, with significant areas not served by any operator. Copyright nPerf

For further information please contact:

 

EnSilica plc

Ian Lankshear, Chief Executive Officer

www.ensilica.com

 Via Vigo Consulting

+44 (0)20 7390 0233
 

VITES GmbH

Martin Gassner, Chief Executive Officer

www.vites.de

 

  

+49 (0)89 6088 4600

info@VITES.DE
Sonus PR (Technology Public Relations)

Rob Ashwell

 +44 (0)7800 515 001 ensilica@sonuspr.com.com

 

About EnSilica

EnSilica is a leading fabless design house focused on custom ASIC design and supply for OEMs and system houses, as well as IC design services for companies with their own design teams. The company has world-class expertise in supplying custom RF, mmWave, mixed signal and digital ICs to its international customers in the automotive, industrial, healthcare and communications markets. The company also offers a broad portfolio of core IP covering cryptography, radar, and communications systems. EnSilica has a track record of delivering high quality solutions to demanding industry standards. The company is headquartered near Oxford, UK and has design centres across the UK, in Bangalore, India and in Port Alegre, Brazil.

 

About VITES

VITES GmbH (“VITES”) is an innovative German supplier of high-performance broadband wireless systems and customized solutions for professional applications. Main focus is the development of FPA-terminals for SATCOM-on-the-Move applications. These terminals are based on a power efficient active phased array technology, appropriate for any kind of vehicle, including governmental as well as commercial use.

In the areas of public safety, security and disaster management, VITES offers nomadic LTE-/5G- (ViCell) as well as broadband IP-Mesh-Networks (ViMesh). The brand vikomobil 2.0 represents complete customer specific mobile communication nodes (“cell on wheels”) that are energy autonomous and integrate SATCOM.

EnSilica und VITES kooperieren bei der Chipsatz-Entwicklung zur Realisierung energie- und kosteneffizienter Flat-Panel-Terminals für NGSO-Konstellationen

Fokus auf breitbandige SATCOM-Datenanbindung während der Fahrt. Erste Anwendungen umfassen kommerzielle Fahrzeuge und solche der Sicherheitsbehörden

  

EnSilica (AIM: ENSI), ein führender Anbieter von Mixed-Signal-ASICs und SoCs, gibt bekannt, die VITES GmbH mit einem neuen Beamforming-Chipsatz (elektronische Funkstrahl-Formung) für Satelliten-User-Terminals zu beliefern. VITES wird die ASIC-Entwicklung maßgeblich begleiten und den Chipsatz in seinen neuen ViSAT-Ka-Band-Terminals einsetzen.

 

Der Beamforming-Chipsatz von EnSilica ist daraufhin optimiert, energie- und kosteneffiziente, bodengestützte Flat-Panel-User-Terminals für Satellitenkommunikationssysteme realisieren zu können, die sich für ortsfeste SATCOM- und mobile SATCOM-on-the-Move-/Communications-on-the-Move Anwendungen eignen.

VITES ist auf Breitband-Funksysteme für professionelle Anwendungen spezialisiert und liefert seit 2019 Flat-Panel-Terminals auf Basis einer eigenen Phased-Array-Technologie.

Integriert in Fahrzeuge, ermöglicht das neue ViSAT-Ka-Band-Terminal der VITES die Konnektivität mit Satelliten während der Fahrt (Communications-on-the-Move, COTM). Das Terminal ist in der Lage, den Funkstrahl vollelektronisch auf die Bewegung von erdnahen Satelliten (LEO, Low Earth Orbit) und anderen nicht geosynchronen Satelliten (NGSO) nachzuführen. Nutzer erhalten damit einen schnellen Netzwerkzugang überall auf der Welt, auch während der Fahrt.

ViSAT-Ka basiert auf einer skalierbaren Architektur, die sehr energieeffiziente TDD- und FDD-Terminals zu erschwinglichen Preisen ermöglicht. Auf dieser fortschrittlichen technischen Basis entwickelt VITES Terminals für Land- und Seefahrzeuge aller Art – auch für kostensensitive Automotive-Anwendungen, die zudem eine sehr geringe Verlustleistung erfordern.

Mit dieser Technologie haben Fahrzeuge auch außerhalb der 4G-/5G-Netzabdeckung Zugang zu „Always-on“-Breitbandverbindungen mit hohem Durchsatz – und das in einer sehr flachen, kompakten Formgebung, die sich gleichermaßen für Nachrüstungen, als auch für die Fahrzeug-Erstausrüstung ab Werk eignet.

Paul Morris, VP der RF and Communications Business Unit bei EnSilica, dazu:

„EnSilica investiert seit mehreren Jahren in diesen Bereich und arbeitet eng mit der UK Space Agency, der European Space Agency und der VITES GmbH zusammen. VITES hat klare Anforderungen für die Beamforming-Chips geliefert, so dass wir unsere Lösung für den Markt optimieren konnten. Der Chipsatz lässt sich mit Ka- und Ku-Band-RFICs kombinieren, einschließlich unserem EN92030 Ka-band-Chip, so dass er die verschiedenen LEO- oder GEO-Konstellationen abdeckt.“ 

Martin Gassner, CEO von VITES, fügte hinzu:

„Für die kommenden NGSO-Konstellationen sind Terminals erforderlich, die in Bezug auf Performance, Energieeffizienz und Herstellungskosten einen Quantensprung darstellen. Diese Anforderungen erfüllen wir mit unseren neuen ViSAT-Ka-Band-Terminals. Wir freuen uns über die Partnerschaft mit EnSilica und die Zusammenarbeit bei der Entwicklung von COTM-Lösungen, die Breitbandverbindungen auch dort ermöglichen, wo es keinen Zugang zu terrestrischen Netzen gibt.“

Bild 1: Das ViSAT-Ka-Band-Terminal misst je nach Version zwischen ca. 16 x 10 cm und 50 x 30 cm und ist für den Einbau in Fahrzeuge für Communications-on-the-Move vorgesehen

       

Bild 2: 4G- und 5G-Abdeckung in Deutschland, wobei wesentliche Gebiete von keinem Betreiber versorgt werden (Quelle: nPerf).

Kontakt für weitere Informationen:

 

EnSilica plc

Ian Lankshear, Chief Executive Officer

www.ensilica.com

 Via Vigo Consulting

+44 (0)20 7390 0233
 

VITES GmbH

Martin Gassner, Chief Executive Officer

www.vites.de

 

  

+49 (0)89 6088 4600

info@VITES.DE
Sonus PR (Technology Public Relations)

Rob Ashwell

 +44 (0)7800 515 001 ensilica@sonuspr.com.com

 

Über EnSilica

EnSilica ist ein führendes Fabless-Design-Unternehmen, das sich auf kundenspezifisches ASIC-Design für Erstausrüster (OEMs) und Systemhäuser sowie auf IC-Designdienstleistungen für Firmen mit eigener IC-Entwicklung konzentriert. Das Unternehmen besitzt erstrangige Erfahrungen in der Entwicklung kundenspezifischer HF-, mmWave-, Mixed-Signal- und Digital-ICs für internationale Kunden in den Bereichen Automotive, Industrie, Gesundheitswesen und Kommunikation. Darüber hinaus bietet das Unternehmen ein breites Spektrum an Kern-IP für Kryptographie, Radar und Kommunikationssysteme. EnSilica hat umfangreiche Erfahrung in der Lieferung qualitativ hochwertiger Dienstleistungen, die anspruchsvolle Industrienormen erfüllen. Das Unternehmen hat seinen Hauptsitz in der Nähe von Oxford, Großbritannien, und verfügt über Entwicklungszentren in ganz Großbritannien, in Bangalore, Indien, und in Port Alegre, Brasilien.

Über VITES

Die VITES GmbH („VITES“) ist ein innovativer deutscher Anbieter hochleistungsfähiger Breitband-Funksysteme und kundenspezifischer Lösungen für professionelle Anwendungen. Der Schwerpunkt liegt auf der Entwicklung von Flat-Panel-Terminals für Communications-on-the-Move-Anwendungen. Diese Terminals basieren auf einer energieeffizienten aktiven Phased-Array-Technologie, die für jede Art von Fahrzeugen geeignet ist, sowohl für den kommerziellen Einsatz als auch bei Sicherheitsbehörden.

Im Bereich öffentliche Sicherheit und Katastrophenschutz bietet VITES nomadische LTE-/5G- (ViCell) als auch breitbandige IP-Mesh-Netze (ViMesh) an. Die Marke vikomobil 2.0 steht für mobile energieautarke Mobilfunkknoten („Mobilfunkzelle auf Rädern“) die zusätzlich SATCOM integrieren.

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EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices

EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices

 

Evaluation platform supports wide range of sensors for battery powered medical and fitness devices including ECG, PPG, temperature and optical signals, including for NIR spectroscopy

 

Oxford, UK – 12 April 2023 – EnSilica (LON:ENSI), a leading ASIC and mixed signal chip maker, has released an evaluation platform to speed up the development of wearable fitness and healthcare vital-sign monitoring systems.

 

EnSilica’s EN62020 ultra low power healthcare sensor interface ASIC, supports a variety of vital sign measurements. These include ECG, PPG (Heart rate, Oxygen Saturation SpO2), temperature. The optical interface to LEDs and photodiodes can also be used for near infrared spectroscopy (NIRS), and the monitoring of chemical substances in the blood, such as glucose.

 

Specifications

The size and power-optimised design of the EN62020 makes the device well-suited to compact healthcare devices, patches, and sports / fitness devices. The highly sensitive capacitive sensor interface also makes the device well suited for novel MEMS sensors.

 

The ASIC incorporates multiple analogue front ends (AFEs) including:

  • Two differential ECG sensor channels suitable for 3-lead ECG with <2.5µVrms noise levels and CMRR of 70dB@50/100Hz
  • A highly sensitive capacitive sensor channel
  • A temperature sensor (35-45oC, <0.15oC resolution)
  • Two photodiode drivers/photodetector readouts with SNR over 70dB and Read-out dynamic range of 105dB
  • The device can also interface to other optical or current sensors, such as fluorescent glucose probes

 

Designed to work alongside an edge processor, or a communication device, the EN62020 uses a single 1.2 – 3.6V supply, has a flexible IO voltage and consumes as low as ~10µA per AFE.

 

The evaluation platform comes with a 10cm x 10cm evaluation board fitted with an EN62020, an MCU interface board for PC connection, and a graphical user interface (GUI) software for the control of EN62020.

 

The evaluation platform is available from the EnSilica website EN62020 request form.

 

It is also available via EnSilica partners Cedar Technologies (Europe) and QLS (North America).

ESA and UK Space Agency back EnSilica to develop satellite broadband chip

EnSilica to develop satellite communications chip for next generation user terminals

 

Oxford, UK – 17 February 2023 – EnSilica (AIM:ENSI), a leading ASIC and mixed signal chip maker, has announced a contract to develop a new chip to address the next generation of mass market satellite broadband user terminals.

The contract has been awarded through the European Space Agency’s (ESA) Advanced Research in Telecommunications Systems Core Competitiveness programme (“ARTES CC”), through the support of the UK Space Agency.

The chip in development will enable a new generation of lower-cost, low-power satellite broadband user terminals, which track the relative movement of low-earth orbit satellites and allow users to access high bandwidth connectivity when out of reach of terrestrial networks.

Use cases include satellite communication-on-the-move (SOTM) for automotive, maritime, and aerospace connectivity as well as extending broadband access to users without internet access.

Dietmar Schmitt, Head of Technologies & Products Division at ESA, said “ESA is pleased to continue our collaboration with EnSilica through the ARTES Core Competitiveness programme and to support this important technology development, which will facilitate the provision of high capacity connectivity across a wide range of use cases.”

Henny Sands, Head of Telecoms at the UK Space Agency, described EnSilica’s satellite broadband user terminals chip as “a brilliant example of the diversity of expertise in the UK’s leading satellite communications sector.”

He added: “Through the ARTES CC programme the UK Space Agency aims to champion UK companies that have the right expertise and ambition to become global players in this market and lead on ground-breaking technologies that will enhance the wider UK space sector, create jobs and generate further investment. That’s why we recently announced £50 million of funding for ambitious and innovative projects that will supercharge the UK’s satellite communications industry.”

Paul Morris, VP RF and Communications BU, commented: “We are delighted to be continuing our successful partnerships with both UK Space Agency and ESA to further develop innovative semiconductor solutions for the next generation of satellite broadband user terminals.”

About EnSilica

EnSilica is a leading fabless design house focused on custom ASIC design and supply for OEMs and system houses, as well as IC design services for companies with their own design teams. The company has world-class expertise in supplying custom RF, mmWave, mixed signal and digital ICs to its international customers in the automotive, industrial, healthcare and communications markets. The company also offers a broad portfolio of core IP covering cryptography, radar, and communications systems. EnSilica has a track record in delivering high quality solutions to demanding industry standards. The company is headquartered near Oxford, UK and has design centres across the UK and in India and Brazil.

About ESA’S ARTES Core Competitiveness Programme

ESA’s ARTES (Advanced Research in Telecommunications Systems) programme is unique in Europe and aims to support the competitiveness of European and Canadian industry on the world market. Core Competitiveness is dedicated to the development, qualification and demonstration of products (“Competitiveness and Growth”), or long-term technology development (“Advanced Technology”). Products in this context can be equipment for the platform or payload of a satellite, a user terminal, or a full telecom system integrating a network with its space segment.

Find out more at: https://artes.esa.int/core-competitiveness

EnSilica growth continues with new Bristol ASIC design office

EnSilica has opened a new design centre in Bristol

 

Extends recruitment drive following period of strong growth

Oxford, UK – October 26, 2022 – EnSilica has today opened a new design centre in Bristol. The office, its fourth in the UK, will open with a staff of 14 highly-experienced engineers and a particular focus on advanced node ASIC design.

The new office opens following a period of significant growth, and Bristol chosen for its heritage, its university links and the quality of life offered by the city.

The company is now looking to expand both in Bristol and its other offices across the UK, initiating a recruitment drive both graduate and senior levels.

The design cente joins EnSilica’s existing headquarters and design facility near Oxford, and a design centre in Sheffield. The company also has a specialist centre in Bangalore, India and a design facility in Porto Alegre, in southern Brazil.

EnSilica’s VP of SoC Engineering and head of the Bristol office, Davide Sarta said:

“The city was a natural choice for us as we go through this period of significant growth. The city is home to one of the UK’s largest electronics hubs. The university is a leading centre of excellence for electronics. And the quality of life that the city offers means that many of those we’re hoping to employ will want to be there.

EnSilica is a former winner of the Queen’s Award for International Trade; and has been ranked in the top 5 in the Sunday Times Lloyds SME Export Track 100, and regularly wins awards for its engineering.

The company recently reported its first financials since its successful IPO in May, with 77% year-on-year revenue growth.

EnSilica is looking to recruit engineers in analogue, physical, system-level design, DFT and verification across UK at both graduate and more-senior levels.

 

About EnSilica

EnSilica is a leading fabless chipmaker focused on custom ASIC for OEMs and system houses, as well as IC design services for companies with their own design teams. The company has world-class expertise in supplying custom RF, mmWave, mixed signal and digital ICs to its international customers in the automotive, industrial, healthcare and communications markets. The company also offers a broad portfolio of core IP covering cryptography, radar, and communications systems. EnSilica has a track record in delivering high quality solutions to demanding industry standards. The company is headquartered near Oxford, UK and has design centres across the UK and in India and Brazil.

 

ensilica open sign

London Stock Exchange welcomes EnSilica plc to AIM

EnSilica is a designer and supplier of mixed signal ASICs (Application Specific Integrated Circuit). ASICs are Integrated Circuits or semiconductor chips developed for a particular use or product rather than for general purpose usage.  ASICs help differentiate products through optimised hardware making products smaller, faster, lower power, improved security, add novel functionality, improving supply chain security and protecting product from being copied.

 

The Company has expertise in the area of designing complex mixed signal ASICs. Mixed signal ASICs combine digital and analogue functions onto a single chip. They are the most complex chips to design hence the highest value.

The Company was established in 2001 as a specialist consultancy designing ICs on a contract basis. Using over 15 years’ first-hand industry experience, the Company was able to begin transitioning to a fabless design and supply business model in 2016. EnSilica now provides an end-to-end service for the design and supply of ASICs, outsourcing certain elements such as the wafer fabrication of the manufacturing and packaging to third parties – otherwise known as a Fabless Semiconductor Model. This is a proven model for growth and profitability used by many European companies including Dialog Semiconductor, Cambridge Silicon Radio, Wolfson and Nordic Semiconductor.

EnSilica’s customers currently range from global corporations and OEMs to technology start-ups, including automotive Tier 1s, industrial enterprises, as well as large software companies and service providers developing proprietary hardware.  EnSilica is an approved supplier to some of the world’s largest automotive and industrial OEMs and Tier 1 suppliers.

Transaction Details

EnSilica, a leading designer and supplier of mixed signal ASICs (Application Specific Integrated Circuit), is pleased to announce its admission to trading on the AIM market of the London Stock Exchange. Dealings on AIM are expected to commence at 8.00 a.m. on 24 May 2022, under the ticker ENSI and ISIN GB00BN7F1618.

In connection with Admission, EnSilica has raised £6 million through a placing and subscription of 12,000,000 Ordinary Shares at a price of 50p per share and will have a market capitalisation of approximately £37.6 million at the Placing Price.

The Directors believe that the Group has reached a stage in its development where it will benefit from a quotation on AIM and that, as well as providing the Company with the net proceeds of the Fundraising, this will:

  • enhance both transparency and international profile of EnSilica with existing and potential customers;
  • allow the Company to access equity capital creating flexibility to fund growth and support potential M&A opportunities;
  • enable EnSilica to attract, recruit and retain key employees who may be further incentivised through share option schemes ; and
  • create a platform for existing shareholders to participate in the future growth of the Company

Ian Lankshear, Chief Executive Officer of EnSilica commented:

“We are delighted to be floating EnSilica on AIM and believe this represents a major endorsement of our business.  Our quoted status will provide an ideal platform from which to accelerate a number of growth initiatives which will ultimately further expand both market reach and customer footprint.

Having developed a reputation of excellence and innovation over the past 21 years, we firmly believe our mixed signal and RF design and supply capabilities are ideally placed to further capitalise on the significant demand for ASICs across our key markets.

We are excited by the numerous opportunities that being a quoted company will bring and we look forward to further developing EnSilica over the coming years.”

London Stock Exchange Logo

EnSilica to list on London Stock Exchange’s AIM market, expected to begin trading from 24th May

OXFORD, United Kingdom –May 19, 2022 – EnSilica, the UK-headquartered specialist designer and supplier of mixed signal ASICs has announced it is set to be listed on the London Stock Exchange’s AIM market. Trading is expected to begin from the 24th May under the ticker ENSI.

AIM is the LSE’s market for small and medium sized growth companies, with over 1,200 companies listed on it.

In connection with the Admission, EnSilica has raised £6 million (USD 7.4m) through a placing and subscription of 12,000,000 Ordinary Shares at a price of 50p per share and will open with a market capitalisation of £37.6 million (USD 46.6m).

The company designs ASICs for system developers working across the automotive, satellite and healthcare sectors. Its CEO, Ian Lankshear said “Our quoted status will provide an ideal platform from which to accelerate a number of growth initiatives, which will ultimately further expand both market reach and customer footprint.

“Having developed a reputation of excellence and innovation over the past 21 years, we firmly believe our mixed signal and RF design and supply capabilities are ideally placed to further capitalise on the significant demand for ASICs across our key markets.”

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EnSilica announces sensor interface IC targets wearable medical device markets

The chip, which will be initially available with evaluation boards, has been created to meet the needs of a diverse array of home-use and single-use medical sensors – from oximeters to smart plasters – as well as wearable healthcare sensors and fitness trackers. According to EnSilica, the IC is among the first of its kind […]

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