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EnSilica Agrees $18m Design and Supply ASIC Contract with European Industrial Customer

Oxford, UK

EnSilica, a leading chip maker of mixed signal ASICs (“Application Specific Integrated Circuits”), is pleased to announce that it has been awarded an $18m design and supply contract by a leading European based supplier of electromechanical products for a Cortex M series Arm-based mixed signal sensor interface ASIC to be used across a range of automotive and industrial applications. The total value of the contract is estimated to exceed $18m over seven years.

 

EnSilica has been selected due to its significant experience in developing mixed signal design ASICs, alongside a proven track record of bringing automotive and industrial chips to high volume production.

The part will be qualified to the stringent automotive standard AEC-Q100 grade 0 and EnSilica’s in-house functional safety flow will be used to design the ASIC to meet the requirements defined in ISO26262 Automotive Safety Integrity Level B (ASIL-B).

 

Ian Lankshear, CEO of EnSilica, commented: “This is another exciting design win that enhances our growing portfolio of ASICs and further improves the visibility of our recurring revenues from chip supply. This new European customer is highly respected in the industry and has a strong track record of shipping its products in high volume. This contract is a testament to the company’s ability to deliver high-quality, reliable solutions that meet the evolving needs of the market and further demonstrates our team’s commitment to excellence and innovation which continues to drive our success and position EnSilica as a premier European ASIC supplier.”

EnSilica Opens Second Brazilian Design Centre Following Multimillion Pound Design and Manufacturing Contract Win

 

Oxford, UK

EnSilica, a leading maker of mixed-signal ASICs, has opened a second design centre in Brazil after a series of design wins, the most recent being a multimillion-pound design and manufacturing contract from an optical computing systems customer. The new design centre is in Campinas, São Paulo State, and complements the company’s Porto Alegre facility in Rio Grande do Sul, in southeastern Brazil.

 

 

Through strengthened relationships with key wafer foundry and semiconductor supply chain partners. EnSilica increasingly provides not only design services but also wafers, packages, and tested devices. This model, which has been successfully developed by several leading Asian chip design companies, is now being leveraged by EnSilica to meet the growing demand for a resilient European-based supply chain.

 

Campinas was chosen for its strong semiconductor ecosystem, which has enabled rapid growth of EnSilica’s existing engineering team in the region.

 

EnSilica CEO, Ian Lankshear, commented: “We are pleased to secure this sizable contract with a pioneering optical computing systems company. This agreement not only underscores our capabilities in delivering comprehensive design and manufacturing services but also highlights the growing demand for European-based supply chains. Our strengthened relationships with key wafer foundry and semiconductor supply chain partners enable us to provide high-quality wafers, packages, and completed tested devices. We are also delighted to be opening our second design centre in Brazil, which further underscores our strategic ambitions to expand our global footprint in order to meet the increasing demand for our services.”

European Space Agency and EnSilica partner to enable fully integrated ASICs for resilient GNSS

In partnership with the European Space Agency (ESA), EnSilica, a leading maker of mixed-signal ASICs, will design and develop a key silicon component to enable next-generation resilient multi-band Global Navigation Satellite System (“GNSS”) capabilities. These are vital to ensuring the world’s critical infrastructure and services remain robust and secure in the face of evolving global threats.

 

EnSilica will design and develop a key silicon component to enable next-generation resilient multi-band Global Navigation Satellite System (“GNSS”) capabilities, which are vital to ensuring the world’s critical infrastructure and services remain robust and secure in the face of evolving global threats.

 

The ESA, NAVISP Element 2 programme helps to increase the competitiveness of participating European states in the global market for satellite navigation and enables these countries to be well positioned to capitalise on emerging market opportunities across Positioning, Navigation and Timing (“PNT”) technologies and services.

 

EnSilica has a growing satellite communications market footprint and is working with support from ESA and UKSA, with the latter organisation awarding the Company £10.38 million in February 2025 for a development project under its Connectivity in Low Earth Orbit programme. Part of the company’s expertise is in architecting and implementing systems-on-chip with high-performance RF, including mmWave, and complex baseband processing.

 

Paul Morris, VP RF and Communications Business Unit at EnSilica, said, “As we and our infrastructure become ever more dependent on PNT services in everyday life, it is important to have highly integrated, resilient, and precise technology sourced in Europe and the UK. This collaboration will allow us to accelerate such technology, starting with a next-generation radio design enabling our partners to focus on integrating their custom algorithms.”

 

Ian Lankshear, Chief Executive Officer of EnSilica, added, “I am extremely proud of our team to have been secured this agreement under the ESA NAVISP Element 2. This project will enable us to further enhance global navigation satellite systems technology and continue to develop commercial solutions that are critical for resilient and reliable satellite navigation. We are grateful for the ongoing support from ESA and the UKSA, and we continue to focus on PNT and the broader satellite communications market as a key growth driver of our business.”

 

UK Space Agency Awards EnSilica £10.38m for Satellite Broadband Terminal Chips

EnSilica (AIM: ENSI), a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), announces that it has been awarded funding from the UK Space Agency under its Connectivity in Low-Earth Orbit (“C-LEO”) programme. Following a competitive selection process, EnSilica has been awarded £10.38 million over the next three-years for a development project pioneered by EnSilica.

 

EnSilica put forward in its application a compelling business case, supported by letters of interest from potential lead customers, to develop a family of semiconductor chips to support future generations of best-in-class, highly integrated, mass market satellite broadband user terminals. The terminals will be capable of connecting with various satellite constellations and will leverage advanced semiconductor technology. In addition, the project will provide a resilient and secure source of chips which is independent and not tied to specific satellite service operators.

 

The market potential for satellite user terminals is growing rapidly, as demonstrated by Starlink, and is projected to reach c. US$16.5 billion by 20311. Each terminal requires hundreds of specialist chips to create an electronically steerable antenna.

 

The UK Space Agency’s C-LEO programme was launched last year and is designed to ensure that the UK space sector remains competitive in the rapidly evolving global market for low-earth orbit constellations. With a total funding pool of up to £160 million available over the next four years, the C-LEO programme supports the development of smarter satellites, enhanced hardware, AI-driven data delivery, and improved inter-satellite connections.

 

This new project builds on EnSilica’s successful history of collaboration with the UK Space Agency and the European Space Agency, alongside other key satellite communications partnerships and the company’s own investment in the technology.

 

Paul Morris, EnSilica VP RF and Comms Business Unit, commented: “This is a great opportunity to accelerate our chipset development enabling us to extend our portfolio of chips for the satellite broadband market with a focus on providing a complete solution for user terminals while reducing cost and power.  We are now engaged with the key European players and I’m sure this further backing from the UK Space Agency will help us garner global interest in the unique products we are developing.”

 

Ian Lankshear, EnSilica’s CEO, commented: “We are honoured and proud to have won this highly significant award from the UK Space Agency under the C-LEO programme, as we believe satellite communications is an incredibly important sector for EnSilica and one that is fast expanding globally. This funding will enable us to advance our technology and bring innovative solutions to the satellite broadband market, with the project expected to be hugely beneficial to society, offering resilient internet connectivity in times of crisis, as well as providing high speed internet connectivity in remote communities not well served by terrestrial networks. We welcome the ongoing support from the UK Space Agency, which provides the framework for EnSilica to develop the technology required to address a market worth many hundreds of millions.”

 

EnSilica joins TSMC Design Center Alliance

We are proud to announce that EnSilica has joined the TSMC Design Center Alliance (DCA). This significant achievement underscores our deep expertise in mixed signal and RF design, now combined with TSMC’s advanced technology to deliver unparalleled solutions to our mutual customers.

EnSilica is committed to providing high-performance ASIC solutions across the automotive, industrial, healthcare, and communications sectors using TSMC technologies. Whether you need high-quality full turnkey ASICs or a comprehensive range of services—from PDK access, design support, MPW shuttles, production tape-out, and wafer supply, to packaging, test development, qualification, and supply chain management—we are here to be your trusted IC Partner.

Read the full press release here.

 

EnSilica: Leading the Way in FinFET Technology

In the dynamic landscape of wireless communication, semiconductor innovations play a pivotal role. Among these, FinFET technology stands out as a game-changer. Let’s explore how FinFETs are shaping the future of 5G and satellite communication.

MIMO Systems: A Brief Overview

Deployment of 5G terrestrial and satellite communications relies heavily on the integration of Multiple-Input, Multiple-Output (MIMO) systems to meet the link budget requirements and mitigate interference.

Fin field-effect transistors (FinFETs), represent a departure from traditional planar transistors. Their three-dimensional fin-like structure allows for better control over current flow, reducing the leakage and improving power efficiency. This technology has been the key enabler for the design of highly integrated digital radio ASICs, based on RF ADCs and DACs, supporting multiple standards.

Key Changes with FinFETs

  1. Improved RF and Analog performance:
  • FinFETs exhibit superior Gm and Rout characteristic, which is paramount to implement the highly linear analog signal processing required in MIMO systems.
  • Excellent RF performance with fT values of 600GHz.
  • MIMO signals remain pristine even in challenging environments.
  1. Power Efficiency Boost:
  • The subthreshold slope of FinFET devices is practically ideal. This drastically reduces leakage current—the silent power drain—that has plagued semiconductor devices for years.
  • For 5G devices and satellite communication terminals, where power constraints are stringent, FinFET-based designs shine.

 

Design Challenges

Despite the improvements in performance, FinFET technology introduces complexity in the design that impact the work of engineers and their approach to RF ASICs.

Now more than ever analog designers, who delve into the intricacies of FinFET, need accurate modelling to ensure that their designs align with the theoretical predictions. Rigorous simulations validate performance metrics, allowing for confident deployment.

At the same time designers face a delicate balancing act. Performance, power consumption, and chip area—these factors intertwine. Effective trade-offs lead to optimized designs that meet real-world requirements.

Impact on Satellite Communication

  • Custom ASICs empower cost-effective, low-power satellite broadband user terminals.
  • These terminals, based on MIMO communication systems, enable seamless connectivity, even in remote areas. Collaborations with space agencies underscore the commitment to advancing satellite communication technology.
  • Hybrid satellite/5G networks are on the horizon, promising ubiquitous connectivity.

The journey through the FinFET landscape is one of innovation, precision, and impact. As we embrace the future of wireless communication, semiconductor advancements remain a beacon—a testament to human ingenuity.

 

For more in-depth insights, please refer to the full article in the Microwave Journal by EnSilica’s FinFET expert Gabriele Devita

EnSilica to supply beamforming SatCom ICs to Germany’s VITES to enable power- and cost-efficient flat panel terminals for NGSO-constellations

Focus on connectivity systems for moving vehicles. Initial applications include commercial and government land-based vehicles

  

EnSilica (AIM: ENSI), a leading turnkey supplier of mixed signal ASICs and SoCs, has announced it is to supply VITES with a new beamformer chip for satellite user terminals. VITES will use the chip at the heart of its new ViSAT-Ka-band terminal.

EnSilica’s beam-forming chip is optimised to enable VITES’s creation of power- and cost-efficient ground-based flat panel user terminals for satellite communication systems that can be used across a range of fixed and SatCom on the move (SOTM) applications.VITES specialises in broadband wireless systems for professional applications and has been delivering flat panel terminals based on its own phased array technology since 2019.

Its new ViSAT-Ka-band terminal is intended to be integrated into vehicles for Communications-on-the Move applications. As such it is able to track the movement of low earth orbit (LEO) and other non geo synchronous (NGSO) satellites and allows users to access high-speed connectivity anywhere on the planet while the vehicle is moving.

ViSAT-Ka uses an innovative scalable architecture that enables extremely power efficient TDD and FDD terminals at affordable prices. On this advanced technical base, VITES is developing terminals for both land-based and maritime vehicles of any kind, including for cost and power sensitive automotive applications.

This means that vehicles can access “Always on” broadband connections outside of 4G / 5G network coverage areas, with high throughput, and in an ultra-compact form factor that allows for both retro and line fitting.

Paul Morris, VP of the RF and communications business unit at EnSilica commented:

“EnSilica has been investing in this area for several years working closely with the UK Space Agency, European Space Agency and VITES GmbH. VITES have provided clear terminal requirements so we have been able to optimise our solution for the market. This beamformer chip can be paired with a range of Ka- and Ku-band RFICs including our own EN92030 allowing it to cover the various LEO or GEO constellations. “ 

Martin Gassner, CEO of VITES said:

“For the upcoming NGSO-constellations, quantum leap solutions are required in order to drive performance up, while driving cost and power consumption down. Our new ViSAT-Ka-Band terminals are the solution to these challenges. We’re delighted to be partnering with EnSilica and working closely with them on leading SOTM solutions that are delivering broadband connectivity even when there is no access to terrestrial networks.”

 

 Fig 1) The ViSAT-Ka-band terminal is intended to be integrated into vehicles for Communications-on-the Move.

       

Fig 2) Map showing 4G and 5G coverage in US and Germany, with significant areas not served by any operator. Copyright nPerf

For further information please contact:

 

EnSilica plc

Ian Lankshear, Chief Executive Officer

www.ensilica.com

 Via Vigo Consulting

+44 (0)20 7390 0233
 

VITES GmbH

Martin Gassner, Chief Executive Officer

www.vites.de

 

  

+49 (0)89 6088 4600

info@VITES.DE
Sonus PR (Technology Public Relations)

Rob Ashwell

 +44 (0)7800 515 001 ensilica@sonuspr.com.com

 

About EnSilica

EnSilica is a leading fabless design house focused on custom ASIC design and supply for OEMs and system houses, as well as IC design services for companies with their own design teams. The company has world-class expertise in supplying custom RF, mmWave, mixed signal and digital ICs to its international customers in the automotive, industrial, healthcare and communications markets. The company also offers a broad portfolio of core IP covering cryptography, radar, and communications systems. EnSilica has a track record of delivering high quality solutions to demanding industry standards. The company is headquartered near Oxford, UK and has design centres across the UK, in Bangalore, India and in Port Alegre, Brazil.

 

About VITES

VITES GmbH (“VITES”) is an innovative German supplier of high-performance broadband wireless systems and customized solutions for professional applications. Main focus is the development of FPA-terminals for SATCOM-on-the-Move applications. These terminals are based on a power efficient active phased array technology, appropriate for any kind of vehicle, including governmental as well as commercial use.

In the areas of public safety, security and disaster management, VITES offers nomadic LTE-/5G- (ViCell) as well as broadband IP-Mesh-Networks (ViMesh). The brand vikomobil 2.0 represents complete customer specific mobile communication nodes (“cell on wheels”) that are energy autonomous and integrate SATCOM.

EnSilica und VITES kooperieren bei der Chipsatz-Entwicklung zur Realisierung energie- und kosteneffizienter Flat-Panel-Terminals für NGSO-Konstellationen

Fokus auf breitbandige SATCOM-Datenanbindung während der Fahrt. Erste Anwendungen umfassen kommerzielle Fahrzeuge und solche der Sicherheitsbehörden

  

EnSilica (AIM: ENSI), ein führender Anbieter von Mixed-Signal-ASICs und SoCs, gibt bekannt, die VITES GmbH mit einem neuen Beamforming-Chipsatz (elektronische Funkstrahl-Formung) für Satelliten-User-Terminals zu beliefern. VITES wird die ASIC-Entwicklung maßgeblich begleiten und den Chipsatz in seinen neuen ViSAT-Ka-Band-Terminals einsetzen.

 

Der Beamforming-Chipsatz von EnSilica ist daraufhin optimiert, energie- und kosteneffiziente, bodengestützte Flat-Panel-User-Terminals für Satellitenkommunikationssysteme realisieren zu können, die sich für ortsfeste SATCOM- und mobile SATCOM-on-the-Move-/Communications-on-the-Move Anwendungen eignen.

VITES ist auf Breitband-Funksysteme für professionelle Anwendungen spezialisiert und liefert seit 2019 Flat-Panel-Terminals auf Basis einer eigenen Phased-Array-Technologie.

Integriert in Fahrzeuge, ermöglicht das neue ViSAT-Ka-Band-Terminal der VITES die Konnektivität mit Satelliten während der Fahrt (Communications-on-the-Move, COTM). Das Terminal ist in der Lage, den Funkstrahl vollelektronisch auf die Bewegung von erdnahen Satelliten (LEO, Low Earth Orbit) und anderen nicht geosynchronen Satelliten (NGSO) nachzuführen. Nutzer erhalten damit einen schnellen Netzwerkzugang überall auf der Welt, auch während der Fahrt.

ViSAT-Ka basiert auf einer skalierbaren Architektur, die sehr energieeffiziente TDD- und FDD-Terminals zu erschwinglichen Preisen ermöglicht. Auf dieser fortschrittlichen technischen Basis entwickelt VITES Terminals für Land- und Seefahrzeuge aller Art – auch für kostensensitive Automotive-Anwendungen, die zudem eine sehr geringe Verlustleistung erfordern.

Mit dieser Technologie haben Fahrzeuge auch außerhalb der 4G-/5G-Netzabdeckung Zugang zu „Always-on“-Breitbandverbindungen mit hohem Durchsatz – und das in einer sehr flachen, kompakten Formgebung, die sich gleichermaßen für Nachrüstungen, als auch für die Fahrzeug-Erstausrüstung ab Werk eignet.

Paul Morris, VP der RF and Communications Business Unit bei EnSilica, dazu:

„EnSilica investiert seit mehreren Jahren in diesen Bereich und arbeitet eng mit der UK Space Agency, der European Space Agency und der VITES GmbH zusammen. VITES hat klare Anforderungen für die Beamforming-Chips geliefert, so dass wir unsere Lösung für den Markt optimieren konnten. Der Chipsatz lässt sich mit Ka- und Ku-Band-RFICs kombinieren, einschließlich unserem EN92030 Ka-band-Chip, so dass er die verschiedenen LEO- oder GEO-Konstellationen abdeckt.“ 

Martin Gassner, CEO von VITES, fügte hinzu:

„Für die kommenden NGSO-Konstellationen sind Terminals erforderlich, die in Bezug auf Performance, Energieeffizienz und Herstellungskosten einen Quantensprung darstellen. Diese Anforderungen erfüllen wir mit unseren neuen ViSAT-Ka-Band-Terminals. Wir freuen uns über die Partnerschaft mit EnSilica und die Zusammenarbeit bei der Entwicklung von COTM-Lösungen, die Breitbandverbindungen auch dort ermöglichen, wo es keinen Zugang zu terrestrischen Netzen gibt.“

Bild 1: Das ViSAT-Ka-Band-Terminal misst je nach Version zwischen ca. 16 x 10 cm und 50 x 30 cm und ist für den Einbau in Fahrzeuge für Communications-on-the-Move vorgesehen

       

Bild 2: 4G- und 5G-Abdeckung in Deutschland, wobei wesentliche Gebiete von keinem Betreiber versorgt werden (Quelle: nPerf).

Kontakt für weitere Informationen:

 

EnSilica plc

Ian Lankshear, Chief Executive Officer

www.ensilica.com

 Via Vigo Consulting

+44 (0)20 7390 0233
 

VITES GmbH

Martin Gassner, Chief Executive Officer

www.vites.de

 

  

+49 (0)89 6088 4600

info@VITES.DE
Sonus PR (Technology Public Relations)

Rob Ashwell

 +44 (0)7800 515 001 ensilica@sonuspr.com.com

 

Über EnSilica

EnSilica ist ein führendes Fabless-Design-Unternehmen, das sich auf kundenspezifisches ASIC-Design für Erstausrüster (OEMs) und Systemhäuser sowie auf IC-Designdienstleistungen für Firmen mit eigener IC-Entwicklung konzentriert. Das Unternehmen besitzt erstrangige Erfahrungen in der Entwicklung kundenspezifischer HF-, mmWave-, Mixed-Signal- und Digital-ICs für internationale Kunden in den Bereichen Automotive, Industrie, Gesundheitswesen und Kommunikation. Darüber hinaus bietet das Unternehmen ein breites Spektrum an Kern-IP für Kryptographie, Radar und Kommunikationssysteme. EnSilica hat umfangreiche Erfahrung in der Lieferung qualitativ hochwertiger Dienstleistungen, die anspruchsvolle Industrienormen erfüllen. Das Unternehmen hat seinen Hauptsitz in der Nähe von Oxford, Großbritannien, und verfügt über Entwicklungszentren in ganz Großbritannien, in Bangalore, Indien, und in Port Alegre, Brasilien.

Über VITES

Die VITES GmbH („VITES“) ist ein innovativer deutscher Anbieter hochleistungsfähiger Breitband-Funksysteme und kundenspezifischer Lösungen für professionelle Anwendungen. Der Schwerpunkt liegt auf der Entwicklung von Flat-Panel-Terminals für Communications-on-the-Move-Anwendungen. Diese Terminals basieren auf einer energieeffizienten aktiven Phased-Array-Technologie, die für jede Art von Fahrzeugen geeignet ist, sowohl für den kommerziellen Einsatz als auch bei Sicherheitsbehörden.

Im Bereich öffentliche Sicherheit und Katastrophenschutz bietet VITES nomadische LTE-/5G- (ViCell) als auch breitbandige IP-Mesh-Netze (ViMesh) an. Die Marke vikomobil 2.0 steht für mobile energieautarke Mobilfunkknoten („Mobilfunkzelle auf Rädern“) die zusätzlich SATCOM integrieren.