EnSilica adds Post Quantum Cryptography support to eSi-Crypto IP library

First license for EnSIlica’s PQC cores licensed to major semiconductor vendor for 5nm networking chip

OXFORD, United Kingdom – January 15th 2024 – EnSilica (AIM: ENSI), a leading chip maker of mixed-signal ASICs, has added a range of Post-Quantum Cryptography (PQC) accelerators to its eSi-Crypto range of hardware accelerator IP.

These cryptographic algorithms are developed to withstand cyber-attacks from quantum computers, and their launch makes EnSilica one of very few companies to offer advanced cryptographic accelerators to the market as licensable hardware IP cores.

By implementing these in hardware cryptographic operations, such as encryption and decryption, can be performed faster, with lower-power and more securely than software-based implementations.

The first license for EnSilica’s new QPC cores has now been granted to a major semiconductor company for target at a high performance 5nm networking chip.

Why PQC is essential:
Today’s secure communications and financial transactions rely on public-key encryption techniques. These use maths problems a conventional computer cannot readily solve. However, advances in both quantum computing and artificial intelligence-based systems, which are backed by large datasets that need to be kept secured, means there is a real threat that cyber-attacks will break current standards.

As such, the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) published its first draft standard for encryption algorithms capable of resisting quantum attacks in H2 last year. for the first of these cryptographic algorithms was published by the last year, with feedback completed in November.

In its 2023 announcement, the NIST mathematician Dustin Moody, who led the seven-year project to develop the algorithms said their creation meant “We’re getting close to the light at the end of the tunnel, where people will have standards they can use in practice”

EnSilica’s PQC accelerator IP:
EnSilica has added two new PQC accellerators to its eSi-Crypto range of IP:

• eSi-Dilithium is a hardware IP designed for accelerating the NIST FIPS 204 Module Lattice Digital Signature Algorithm called CRYSTALS Dilithium
• eSi-Kyber is a hardware IP designed for accelerating the NIST FIPS 203 Key Encapsulation Mechanism (KEM) called CRYSTALS Kyber.

Dilithium and Kyber algorithms are both part of the Cryptographic Suite for Algebraic Lattices (CRYSTALS) and are based on the computational difficulty of the Module Learning With Errors (MLWE) problem.

Additionally, the eSi-SHA3 has also been added to eSi-Crypto, this is a hardware IP designed for accelerating the NIST FIP 202 cryptographic hashing algorithms including SHA3 and SHAKE

These add to and complement EnSilica’s existing range of non-quantum resistant cryptography accelerators, which include ECC, EDCDA, RSA, AES, DES/3DES, SNOW3G, ChaCha20 and Poly1305 as well as a NIST compliant True Random number generator (TRNG). The cores are suitable for ASIC and FPGA usage and can be pre-configured to meet a range of throughputs and compatible with a range of AMBA buses including APB, AHB and AXI.

The timely adoption of PQC is driven by the concern that sensitive encrypted data harvested today, might one day be compromised once powerful quantum computers emerge. This is a critical security risk for governments safeguarding secrets and businesses handling sensitive and confidential information.


Ian Lankshear, Chief Executive Officer of EnSilica, commented:
“EnSilica’s commitment to technological innovation is reflected in our comprehensive range of cryptographic accelerators IP to address the next generation of cybersecurity threats.

The licensing agreement with this major semiconductor giant validates the intrinsic value of our intellectual property. EnSilica not only licenses its IP to other semiconductor companies but also leverages it in the development of custom ASICs.”

Paul Morris, VP RF and Comms Business Unit, commented:
“EnSilica’s PQC cores will be a critical IP when we are building the next generation communication ASICs for our customers, enabling us to build in robust defences against quantum threats. With quantum-resistant algorithms, PQC not only ensures data integrity and confidentiality but also bolsters non-repudiation, preventing denial of digital signatures and affirming the authenticity of communications in the quantum era.”.

Bernard Wu, VP Sensing and Control Business Unit, commented:
“The cybersecurity landscape is evolving necessitating for the redesign of many ASICs due to the recently enacted EU Network and Information Security (NIS2) legislation. The NIS2 directive, now encompassing industrial and manufacturing sector as well as transportation. Our new QPC IP along with our existing range of non-quantum resistant cryptography accelerators provide us with the technology to secure our customers ASIC so they are fit being supplied well into the next decade.”

EnSilica’s Vasiliki Xiradaki named among UK’s best young engineers in a trio of prestigious industry awards

TechWorks/UK Electronic Skills Foundation

Electronic Weekly’s BrightSparks Awards

The IET Future Talents Scholarship.


EnSilica’s Vasiliki Xiradaki was named among the UK’s top 3 student electronic engineers at the annual TechWorks industry awards  ceremony on the 7th December. The award category, run and presided over by the UK Electronic Skills Foundation follows hot on the heels of Xiradaki being declared among the UK’s 30 best engineers under 30 in Electronics Weekly’s BrightSparks Awards, which was presented just one week earlier on the 30th November.


Completing a hat trick of awards, this month has also seen Xiradaki be awarded Future Talents Scholarship by the IET.


EnSilica CEO Ian Lankshear said: “We’re delighted for Vasiliki and so proud of her, the awards are so very, very deserved.


“Helping young, talented engineers to develop and flourish is an exceptionally important part of our culture and these two awards coupled with Omotade Iluromi winning last year’s TechWork’s Young Engineer of the Year Award are testament to the support given here.”


Xiradaki has been working with EnSilica as an UKESF scholar since for 13 months and is in her 3rd year of an electronic engineering degree at the University of Birmingham. At EnSIlica Xiradaki has played an active role in the company’s satellite communications IC projects, working on both verification and on module design for projects including a Satellite Communications on the Move chip to give commercial, military and disaster recovery vehicles access to high-speed communications anywhere on the planet.


Outside of EnSilica, Xiradaki is an advocate for women in engineering and for engineers from diverse backgrounds. For this, she has been actively participating in many outreach activities across different age groups, visiting more than 10 schools to help bring under-represented groups of people into STEM subjects and electronic engineering degrees. This has helped her be selected by the UKESF to participate in the Academy Achiever’s #BeMeDigitalInclusion charity STEM event which is targeted at black girls from vulnerable backgrounds.

EnSilica enters strategic partnership with Indesmatech to develop custom ASIC’s for IoT modules and Components .

OXFORD, United Kingdom – December 11th 2023 

EnSilica (AIM: ENSI), a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), has announced it has entered into a strategic partnership with the design consultancy and custom module developer IndesmaTech.


The companies will collaborate to develop custom ASICs for next generation IoT modules and systems for IndesmaTech’s client roster across northern Europe, including throughout Germany, the UK and Scandinavia.


The partnership helps us lower the cost of entry to companies considering taking an ASIC approach either for improved product performance or to protect the supply chain,” said Peter Jeuter, EnSilica’s VP of sales, adding: “This deal and the incredible experience of the team at IndesmaTech should help make ASICs more accessible to a greater number of companies looking to take an ASIC approach.”


Indesmatech has said: “Our joint venture aims to accelerate the development of tailor-made IoT devices, offering faster, more efficient, and highly customizable solutions to meet the evolving demands of diverse industries…Our collaboration is designed to cater to specific client needs, ensuring a seamless integration of our advanced ASIC technologies into their IoT applications.”


The strategic partnership deal was signed in Q4 2023.

EnSilica to supply beamforming SatCom ICs to Germany’s VITES to enable power- and cost-efficient flat panel terminals for NGSO-constellations

Focus on connectivity systems for moving vehicles. Initial applications include commercial and government land-based vehicles


EnSilica (AIM: ENSI), a leading turnkey supplier of mixed signal ASICs and SoCs, has announced it is to supply VITES with a new beamformer chip for satellite user terminals. VITES will use the chip at the heart of its new ViSAT-Ka-band terminal.

EnSilica’s beam-forming chip is optimised to enable VITES’s creation of power- and cost-efficient ground-based flat panel user terminals for satellite communication systems that can be used across a range of fixed and SatCom on the move (SOTM) applications.VITES specialises in broadband wireless systems for professional applications and has been delivering flat panel terminals based on its own phased array technology since 2019.

Its new ViSAT-Ka-band terminal is intended to be integrated into vehicles for Communications-on-the Move applications. As such it is able to track the movement of low earth orbit (LEO) and other non geo synchronous (NGSO) satellites and allows users to access high-speed connectivity anywhere on the planet while the vehicle is moving.

ViSAT-Ka uses an innovative scalable architecture that enables extremely power efficient TDD and FDD terminals at affordable prices. On this advanced technical base, VITES is developing terminals for both land-based and maritime vehicles of any kind, including for cost and power sensitive automotive applications.

This means that vehicles can access “Always on” broadband connections outside of 4G / 5G network coverage areas, with high throughput, and in an ultra-compact form factor that allows for both retro and line fitting.

Paul Morris, VP of the RF and communications business unit at EnSilica commented:

“EnSilica has been investing in this area for several years working closely with the UK Space Agency, European Space Agency and VITES GmbH. VITES have provided clear terminal requirements so we have been able to optimise our solution for the market. This beamformer chip can be paired with a range of Ka- and Ku-band RFICs including our own EN92030 allowing it to cover the various LEO or GEO constellations. “ 

Martin Gassner, CEO of VITES said:

“For the upcoming NGSO-constellations, quantum leap solutions are required in order to drive performance up, while driving cost and power consumption down. Our new ViSAT-Ka-Band terminals are the solution to these challenges. We’re delighted to be partnering with EnSilica and working closely with them on leading SOTM solutions that are delivering broadband connectivity even when there is no access to terrestrial networks.”


 Fig 1) The ViSAT-Ka-band terminal is intended to be integrated into vehicles for Communications-on-the Move.


Fig 2) Map showing 4G and 5G coverage in US and Germany, with significant areas not served by any operator. Copyright nPerf

For further information please contact:


EnSilica plc

Ian Lankshear, Chief Executive Officer


Via Vigo Consulting

+44 (0)20 7390 0233



Martin Gassner, Chief Executive Officer




+49 (0)89 6088 4600


Sonus PR (Technology Public Relations)

Rob Ashwell

+44 (0)7800 515 001 ensilica@sonuspr.com.com


About EnSilica

EnSilica is a leading fabless design house focused on custom ASIC design and supply for OEMs and system houses, as well as IC design services for companies with their own design teams. The company has world-class expertise in supplying custom RF, mmWave, mixed signal and digital ICs to its international customers in the automotive, industrial, healthcare and communications markets. The company also offers a broad portfolio of core IP covering cryptography, radar, and communications systems. EnSilica has a track record of delivering high quality solutions to demanding industry standards. The company is headquartered near Oxford, UK and has design centres across the UK, in Bangalore, India and in Port Alegre, Brazil.



VITES GmbH (“VITES”) is an innovative German supplier of high-performance broadband wireless systems and customized solutions for professional applications. Main focus is the development of FPA-terminals for SATCOM-on-the-Move applications. These terminals are based on a power efficient active phased array technology, appropriate for any kind of vehicle, including governmental as well as commercial use.

In the areas of public safety, security and disaster management, VITES offers nomadic LTE-/5G- (ViCell) as well as broadband IP-Mesh-Networks (ViMesh). The brand vikomobil 2.0 represents complete customer specific mobile communication nodes (“cell on wheels”) that are energy autonomous and integrate SATCOM.

EnSilica und VITES kooperieren bei der Chipsatz-Entwicklung zur Realisierung energie- und kosteneffizienter Flat-Panel-Terminals für NGSO-Konstellationen

Fokus auf breitbandige SATCOM-Datenanbindung während der Fahrt. Erste Anwendungen umfassen kommerzielle Fahrzeuge und solche der Sicherheitsbehörden


EnSilica (AIM: ENSI), ein führender Anbieter von Mixed-Signal-ASICs und SoCs, gibt bekannt, die VITES GmbH mit einem neuen Beamforming-Chipsatz (elektronische Funkstrahl-Formung) für Satelliten-User-Terminals zu beliefern. VITES wird die ASIC-Entwicklung maßgeblich begleiten und den Chipsatz in seinen neuen ViSAT-Ka-Band-Terminals einsetzen.


Der Beamforming-Chipsatz von EnSilica ist daraufhin optimiert, energie- und kosteneffiziente, bodengestützte Flat-Panel-User-Terminals für Satellitenkommunikationssysteme realisieren zu können, die sich für ortsfeste SATCOM- und mobile SATCOM-on-the-Move-/Communications-on-the-Move Anwendungen eignen.

VITES ist auf Breitband-Funksysteme für professionelle Anwendungen spezialisiert und liefert seit 2019 Flat-Panel-Terminals auf Basis einer eigenen Phased-Array-Technologie.

Integriert in Fahrzeuge, ermöglicht das neue ViSAT-Ka-Band-Terminal der VITES die Konnektivität mit Satelliten während der Fahrt (Communications-on-the-Move, COTM). Das Terminal ist in der Lage, den Funkstrahl vollelektronisch auf die Bewegung von erdnahen Satelliten (LEO, Low Earth Orbit) und anderen nicht geosynchronen Satelliten (NGSO) nachzuführen. Nutzer erhalten damit einen schnellen Netzwerkzugang überall auf der Welt, auch während der Fahrt.

ViSAT-Ka basiert auf einer skalierbaren Architektur, die sehr energieeffiziente TDD- und FDD-Terminals zu erschwinglichen Preisen ermöglicht. Auf dieser fortschrittlichen technischen Basis entwickelt VITES Terminals für Land- und Seefahrzeuge aller Art – auch für kostensensitive Automotive-Anwendungen, die zudem eine sehr geringe Verlustleistung erfordern.

Mit dieser Technologie haben Fahrzeuge auch außerhalb der 4G-/5G-Netzabdeckung Zugang zu „Always-on“-Breitbandverbindungen mit hohem Durchsatz – und das in einer sehr flachen, kompakten Formgebung, die sich gleichermaßen für Nachrüstungen, als auch für die Fahrzeug-Erstausrüstung ab Werk eignet.

Paul Morris, VP der RF and Communications Business Unit bei EnSilica, dazu:

„EnSilica investiert seit mehreren Jahren in diesen Bereich und arbeitet eng mit der UK Space Agency, der European Space Agency und der VITES GmbH zusammen. VITES hat klare Anforderungen für die Beamforming-Chips geliefert, so dass wir unsere Lösung für den Markt optimieren konnten. Der Chipsatz lässt sich mit Ka- und Ku-Band-RFICs kombinieren, einschließlich unserem EN92030 Ka-band-Chip, so dass er die verschiedenen LEO- oder GEO-Konstellationen abdeckt.“ 

Martin Gassner, CEO von VITES, fügte hinzu:

„Für die kommenden NGSO-Konstellationen sind Terminals erforderlich, die in Bezug auf Performance, Energieeffizienz und Herstellungskosten einen Quantensprung darstellen. Diese Anforderungen erfüllen wir mit unseren neuen ViSAT-Ka-Band-Terminals. Wir freuen uns über die Partnerschaft mit EnSilica und die Zusammenarbeit bei der Entwicklung von COTM-Lösungen, die Breitbandverbindungen auch dort ermöglichen, wo es keinen Zugang zu terrestrischen Netzen gibt.“

Bild 1: Das ViSAT-Ka-Band-Terminal misst je nach Version zwischen ca. 16 x 10 cm und 50 x 30 cm und ist für den Einbau in Fahrzeuge für Communications-on-the-Move vorgesehen


Bild 2: 4G- und 5G-Abdeckung in Deutschland, wobei wesentliche Gebiete von keinem Betreiber versorgt werden (Quelle: nPerf).

Kontakt für weitere Informationen:


EnSilica plc

Ian Lankshear, Chief Executive Officer


Via Vigo Consulting

+44 (0)20 7390 0233



Martin Gassner, Chief Executive Officer




+49 (0)89 6088 4600


Sonus PR (Technology Public Relations)

Rob Ashwell

+44 (0)7800 515 001 ensilica@sonuspr.com.com


Über EnSilica

EnSilica ist ein führendes Fabless-Design-Unternehmen, das sich auf kundenspezifisches ASIC-Design für Erstausrüster (OEMs) und Systemhäuser sowie auf IC-Designdienstleistungen für Firmen mit eigener IC-Entwicklung konzentriert. Das Unternehmen besitzt erstrangige Erfahrungen in der Entwicklung kundenspezifischer HF-, mmWave-, Mixed-Signal- und Digital-ICs für internationale Kunden in den Bereichen Automotive, Industrie, Gesundheitswesen und Kommunikation. Darüber hinaus bietet das Unternehmen ein breites Spektrum an Kern-IP für Kryptographie, Radar und Kommunikationssysteme. EnSilica hat umfangreiche Erfahrung in der Lieferung qualitativ hochwertiger Dienstleistungen, die anspruchsvolle Industrienormen erfüllen. Das Unternehmen hat seinen Hauptsitz in der Nähe von Oxford, Großbritannien, und verfügt über Entwicklungszentren in ganz Großbritannien, in Bangalore, Indien, und in Port Alegre, Brasilien.


Die VITES GmbH („VITES“) ist ein innovativer deutscher Anbieter hochleistungsfähiger Breitband-Funksysteme und kundenspezifischer Lösungen für professionelle Anwendungen. Der Schwerpunkt liegt auf der Entwicklung von Flat-Panel-Terminals für Communications-on-the-Move-Anwendungen. Diese Terminals basieren auf einer energieeffizienten aktiven Phased-Array-Technologie, die für jede Art von Fahrzeugen geeignet ist, sowohl für den kommerziellen Einsatz als auch bei Sicherheitsbehörden.

Im Bereich öffentliche Sicherheit und Katastrophenschutz bietet VITES nomadische LTE-/5G- (ViCell) als auch breitbandige IP-Mesh-Netze (ViMesh) an. Die Marke vikomobil 2.0 steht für mobile energieautarke Mobilfunkknoten („Mobilfunkzelle auf Rädern“) die zusätzlich SATCOM integrieren.

Image of smart watch

EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices

EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices


Evaluation platform supports wide range of sensors for battery powered medical and fitness devices including ECG, PPG, temperature and optical signals, including for NIR spectroscopy


Oxford, UK – 12 April 2023 – EnSilica (LON:ENSI), a leading ASIC and mixed signal chip maker, has released an evaluation platform to speed up the development of wearable fitness and healthcare vital-sign monitoring systems.


EnSilica’s EN62020 ultra low power healthcare sensor interface ASIC, supports a variety of vital sign measurements. These include ECG, PPG (Heart rate, Oxygen Saturation SpO2), temperature. The optical interface to LEDs and photodiodes can also be used for near infrared spectroscopy (NIRS), and the monitoring of chemical substances in the blood, such as glucose.



The size and power-optimised design of the EN62020 makes the device well-suited to compact healthcare devices, patches, and sports / fitness devices. The highly sensitive capacitive sensor interface also makes the device well suited for novel MEMS sensors.


The ASIC incorporates multiple analogue front ends (AFEs) including:

  • Two differential ECG sensor channels suitable for 3-lead ECG with <2.5µVrms noise levels and CMRR of 70dB@50/100Hz
  • A highly sensitive capacitive sensor channel
  • A temperature sensor (35-45oC, <0.15oC resolution)
  • Two photodiode drivers/photodetector readouts with SNR over 70dB and Read-out dynamic range of 105dB
  • The device can also interface to other optical or current sensors, such as fluorescent glucose probes


Designed to work alongside an edge processor, or a communication device, the EN62020 uses a single 1.2 – 3.6V supply, has a flexible IO voltage and consumes as low as ~10µA per AFE.


The evaluation platform comes with a 10cm x 10cm evaluation board fitted with an EN62020, an MCU interface board for PC connection, and a graphical user interface (GUI) software for the control of EN62020.


The evaluation platform is available from the EnSilica website EN62020 request form.


It is also available via EnSilica partners Cedar Technologies (Europe) and QLS (North America).

ESA and UK Space Agency back EnSilica to develop satellite broadband chip

EnSilica to develop satellite communications chip for next generation user terminals


Oxford, UK – 17 February 2023EnSilica (AIM:ENSI), a leading ASIC and mixed signal chip maker, has announced a contract to develop a new chip to address the next generation of mass market satellite broadband user terminals.

The contract has been awarded through the European Space Agency’s (ESA) Advanced Research in Telecommunications Systems Core Competitiveness programme (“ARTES CC”), through the support of the UK Space Agency.

The chip in development will enable a new generation of lower-cost, low-power satellite broadband user terminals, which track the relative movement of low-earth orbit satellites and allow users to access high bandwidth connectivity when out of reach of terrestrial networks.

Use cases include satellite communication-on-the-move (SOTM) for automotive, maritime, and aerospace connectivity as well as extending broadband access to users without internet access.

Dietmar Schmitt, Head of Technologies & Products Division at ESA, said ESA is pleased to continue our collaboration with EnSilica through the ARTES Core Competitiveness programme and to support this important technology development, which will facilitate the provision of high capacity connectivity across a wide range of use cases.”

Henny Sands, Head of Telecoms at the UK Space Agency, described EnSilica’s satellite broadband user terminals chip as “a brilliant example of the diversity of expertise in the UK’s leading satellite communications sector.”

He added: “Through the ARTES CC programme the UK Space Agency aims to champion UK companies that have the right expertise and ambition to become global players in this market and lead on ground-breaking technologies that will enhance the wider UK space sector, create jobs and generate further investment. That’s why we recently announced £50 million of funding for ambitious and innovative projects that will supercharge the UK’s satellite communications industry.”

Paul Morris, VP RF and Communications BU, commented: “We are delighted to be continuing our successful partnerships with both UK Space Agency and ESA to further develop innovative semiconductor solutions for the next generation of satellite broadband user terminals.”

About EnSilica

EnSilica is a leading fabless design house focused on custom ASIC design and supply for OEMs and system houses, as well as IC design services for companies with their own design teams. The company has world-class expertise in supplying custom RF, mmWave, mixed signal and digital ICs to its international customers in the automotive, industrial, healthcare and communications markets. The company also offers a broad portfolio of core IP covering cryptography, radar, and communications systems. EnSilica has a track record in delivering high quality solutions to demanding industry standards. The company is headquartered near Oxford, UK and has design centres across the UK and in India and Brazil.

About ESA’S ARTES Core Competitiveness Programme

ESA’s ARTES (Advanced Research in Telecommunications Systems) programme is unique in Europe and aims to support the competitiveness of European and Canadian industry on the world market. Core Competitiveness is dedicated to the development, qualification and demonstration of products (“Competitiveness and Growth”), or long-term technology development (“Advanced Technology”). Products in this context can be equipment for the platform or payload of a satellite, a user terminal, or a full telecom system integrating a network with its space segment.

Find out more at: https://artes.esa.int/core-competitiveness

EnSilica growth continues with new Bristol ASIC design office

EnSilica has opened a new design centre in Bristol


Extends recruitment drive following period of strong growth

Oxford, UK – October 26, 2022 – EnSilica has today opened a new design centre in Bristol. The office, its fourth in the UK, will open with a staff of 14 highly-experienced engineers and a particular focus on advanced node ASIC design.

The new office opens following a period of significant growth, and Bristol chosen for its heritage, its university links and the quality of life offered by the city.

The company is now looking to expand both in Bristol and its other offices across the UK, initiating a recruitment drive both graduate and senior levels.

The design cente joins EnSilica’s existing headquarters and design facility near Oxford, and a design centre in Sheffield. The company also has a specialist centre in Bangalore, India and a design facility in Porto Alegre, in southern Brazil.

EnSilica’s VP of SoC Engineering and head of the Bristol office, Davide Sarta said:

The city was a natural choice for us as we go through this period of significant growth. The city is home to one of the UK’s largest electronics hubs. The university is a leading centre of excellence for electronics. And the quality of life that the city offers means that many of those we’re hoping to employ will want to be there.

EnSilica is a former winner of the Queen’s Award for International Trade; and has been ranked in the top 5 in the Sunday Times Lloyds SME Export Track 100, and regularly wins awards for its engineering.

The company recently reported its first financials since its successful IPO in May, with 77% year-on-year revenue growth.

EnSilica is looking to recruit engineers in analogue, physical, system-level design, DFT and verification across UK at both graduate and more-senior levels.


About EnSilica

EnSilica is a leading fabless chipmaker focused on custom ASIC for OEMs and system houses, as well as IC design services for companies with their own design teams. The company has world-class expertise in supplying custom RF, mmWave, mixed signal and digital ICs to its international customers in the automotive, industrial, healthcare and communications markets. The company also offers a broad portfolio of core IP covering cryptography, radar, and communications systems. EnSilica has a track record in delivering high quality solutions to demanding industry standards. The company is headquartered near Oxford, UK and has design centres across the UK and in India and Brazil.


ensilica open sign

London Stock Exchange welcomes EnSilica plc to AIM

EnSilica is a designer and supplier of mixed signal ASICs (Application Specific Integrated Circuit). ASICs are Integrated Circuits or semiconductor chips developed for a particular use or product rather than for general purpose usage.  ASICs help differentiate products through optimised hardware making products smaller, faster, lower power, improved security, add novel functionality, improving supply chain security and protecting product from being copied.


The Company has expertise in the area of designing complex mixed signal ASICs. Mixed signal ASICs combine digital and analogue functions onto a single chip. They are the most complex chips to design hence the highest value.

The Company was established in 2001 as a specialist consultancy designing ICs on a contract basis. Using over 15 years’ first-hand industry experience, the Company was able to begin transitioning to a fabless design and supply business model in 2016. EnSilica now provides an end-to-end service for the design and supply of ASICs, outsourcing certain elements such as the wafer fabrication of the manufacturing and packaging to third parties – otherwise known as a Fabless Semiconductor Model. This is a proven model for growth and profitability used by many European companies including Dialog Semiconductor, Cambridge Silicon Radio, Wolfson and Nordic Semiconductor.

EnSilica’s customers currently range from global corporations and OEMs to technology start-ups, including automotive Tier 1s, industrial enterprises, as well as large software companies and service providers developing proprietary hardware.  EnSilica is an approved supplier to some of the world’s largest automotive and industrial OEMs and Tier 1 suppliers.

Transaction Details

EnSilica, a leading designer and supplier of mixed signal ASICs (Application Specific Integrated Circuit), is pleased to announce its admission to trading on the AIM market of the London Stock Exchange. Dealings on AIM are expected to commence at 8.00 a.m. on 24 May 2022, under the ticker ENSI and ISIN GB00BN7F1618.

In connection with Admission, EnSilica has raised £6 million through a placing and subscription of 12,000,000 Ordinary Shares at a price of 50p per share and will have a market capitalisation of approximately £37.6 million at the Placing Price.

The Directors believe that the Group has reached a stage in its development where it will benefit from a quotation on AIM and that, as well as providing the Company with the net proceeds of the Fundraising, this will:

  • enhance both transparency and international profile of EnSilica with existing and potential customers;
  • allow the Company to access equity capital creating flexibility to fund growth and support potential M&A opportunities;
  • enable EnSilica to attract, recruit and retain key employees who may be further incentivised through share option schemes ; and
  • create a platform for existing shareholders to participate in the future growth of the Company

Ian Lankshear, Chief Executive Officer of EnSilica commented:

“We are delighted to be floating EnSilica on AIM and believe this represents a major endorsement of our business.  Our quoted status will provide an ideal platform from which to accelerate a number of growth initiatives which will ultimately further expand both market reach and customer footprint.

Having developed a reputation of excellence and innovation over the past 21 years, we firmly believe our mixed signal and RF design and supply capabilities are ideally placed to further capitalise on the significant demand for ASICs across our key markets.

We are excited by the numerous opportunities that being a quoted company will bring and we look forward to further developing EnSilica over the coming years.”

© Copyright - EnSilica | Privacy Notice | Call Us - UK General : +44 118 321 7310 - UK Sales : +44 118 380 5757 - USA : +1 855 642 1070 - India : +91 80 2258 4450