EnSilica enters strategic partnership with Indesmatech to develop custom ASIC’s for IoT modules and Components .

OXFORD, United Kingdom – December 11th 2023 

EnSilica (AIM: ENSI), a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), has announced it has entered into a strategic partnership with the design consultancy and custom module developer IndesmaTech.

 

The companies will collaborate to develop custom ASICs for next generation IoT modules and systems for IndesmaTech’s client roster across northern Europe, including throughout Germany, the UK and Scandinavia.

 

“The partnership helps us lower the cost of entry to companies considering taking an ASIC approach either for improved product performance or to protect the supply chain,” said Peter Jeuter, EnSilica’s VP of sales, adding: “This deal and the incredible experience of the team at IndesmaTech should help make ASICs more accessible to a greater number of companies looking to take an ASIC approach.”

 

Indesmatech has said: “Our joint venture aims to accelerate the development of tailor-made IoT devices, offering faster, more efficient, and highly customizable solutions to meet the evolving demands of diverse industries…Our collaboration is designed to cater to specific client needs, ensuring a seamless integration of our advanced ASIC technologies into their IoT applications.”

 

The strategic partnership deal was signed in Q4 2023.