EnSilica chassis control ASIC for premium automotive brand enters mass production

2.5 million mixed-signal ASICs to be produced in 1st year


OXFORD, United Kingdom – EnSilica (LON: ENSI), a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), has announced the development of a custom chassis-control ASIC, which has entered mass production, and will appear in vehicles later this year.

The device will first be used in a recently launched flagship model from the premium OEM and is anticipated to be then rolled out to additional vehicles in its range. Depending on the model, up to 24 of the chassis-control devices will be used per vehicle.

2.5 million ASIC devices will ship to the luxury carmaker during the next 12 months, with an anticipated production life of seven years.

About the ASIC

The complex mixed-signal ASIC uses a BCD process with high-voltage transistors, and combines extensive monitoring and fault detection circuits (for example open and short pins, over and under voltage detection and frequency monitoring) with duplicate redundancy on key functions.

The part is qualified to AEC-Q100 grade 0, EnSilica’s in-house functional safety team developed the ASIC to meet the requirement defined in ISO 26262 to the most demanding Automotive Safety Integrity Level (ASIL-D).

Development of the ASIC began in mid 2018 and was signed off for production earlier this year.  Design was undertaken by EnSilica, in close collaboration with leading independent semiconductor testing and qualification firm, RoodMicrotec N.V.

EnSilica selected RoodMicrotec N.V. to support it in the qualification and testing of this mixed signal automotive ASIC. RoodMicrotec N.V. will undertake final testing of the ASIC in its in Nördlingen, Germany facility.

Ian Lankshear, Chief Executive Officer of EnSilica plc, commented:

“Our design team were able to deliver the first silicon samples in less than 12 months, given the complexity of this mixed signal chip and the added overhead of complying to the ISO 26262 at ASIL-D, this was real achievement. Both RoodMicrotec and EnSilica’s teams worked well together to take this through AEC-Q100 qualification, test program development and then preparing it for automotive quality production sign-off.”

Martin Sallenhag, Chief Executive Officer of RoodMicrotec, added:

“It has been exciting to support EnSilica in bringing this project to production over the last few years. We are now looking forward to supporting production of this device in our Nördlingen facility. It again shows the demand for our unique combined capabilities, in depth experience and excellent track record in bringing automotive products to the market for our valued customers.”

Automotive chassis control ASIC

About EnSilica

EnSilica is a leading fabless design house focused on custom ASIC design and supply for OEMs and system houses, as well as IC design services for companies with their own design teams. The company has world-class expertise in supplying custom RF, mmWave, mixed signal and digital ICs to its international customers in the automotive, industrial, healthcare and communications markets. The company also offers a broad portfolio of core IP covering cryptography, radar and communications systems. EnSilica has a track record in delivering high quality solutions to demanding industry standards. The company is headquartered near Oxford, UK and has a design centres across the UK and in Bangalore, India and Porto Alegre, Brazil and listed on the London Stock Exchange’s AIM market (LON: ENSI).



London Stock Exchange welcomes EnSilica plc to AIM

EnSilica is a designer and supplier of mixed signal ASICs (Application Specific Integrated Circuit). ASICs are Integrated Circuits or semiconductor chips developed for a particular use or product rather than for general purpose usage.  ASICs help differentiate products through optimised hardware making products smaller, faster, lower power, improved security, add novel functionality, improving supply chain security and protecting product from being copied.


The Company has expertise in the area of designing complex mixed signal ASICs. Mixed signal ASICs combine digital and analogue functions onto a single chip. They are the most complex chips to design hence the highest value.

The Company was established in 2001 as a specialist consultancy designing ICs on a contract basis. Using over 15 years’ first-hand industry experience, the Company was able to begin transitioning to a fabless design and supply business model in 2016. EnSilica now provides an end-to-end service for the design and supply of ASICs, outsourcing certain elements such as the wafer fabrication of the manufacturing and packaging to third parties – otherwise known as a Fabless Semiconductor Model. This is a proven model for growth and profitability used by many European companies including Dialog Semiconductor, Cambridge Silicon Radio, Wolfson and Nordic Semiconductor.

EnSilica’s customers currently range from global corporations and OEMs to technology start-ups, including automotive Tier 1s, industrial enterprises, as well as large software companies and service providers developing proprietary hardware.  EnSilica is an approved supplier to some of the world’s largest automotive and industrial OEMs and Tier 1 suppliers.

Transaction Details

EnSilica, a leading designer and supplier of mixed signal ASICs (Application Specific Integrated Circuit), is pleased to announce its admission to trading on the AIM market of the London Stock Exchange. Dealings on AIM are expected to commence at 8.00 a.m. on 24 May 2022, under the ticker ENSI and ISIN GB00BN7F1618.

In connection with Admission, EnSilica has raised £6 million through a placing and subscription of 12,000,000 Ordinary Shares at a price of 50p per share and will have a market capitalisation of approximately £37.6 million at the Placing Price.

The Directors believe that the Group has reached a stage in its development where it will benefit from a quotation on AIM and that, as well as providing the Company with the net proceeds of the Fundraising, this will:

  • enhance both transparency and international profile of EnSilica with existing and potential customers;
  • allow the Company to access equity capital creating flexibility to fund growth and support potential M&A opportunities;
  • enable EnSilica to attract, recruit and retain key employees who may be further incentivised through share option schemes ; and
  • create a platform for existing shareholders to participate in the future growth of the Company

Ian Lankshear, Chief Executive Officer of EnSilica commented:

“We are delighted to be floating EnSilica on AIM and believe this represents a major endorsement of our business.  Our quoted status will provide an ideal platform from which to accelerate a number of growth initiatives which will ultimately further expand both market reach and customer footprint.

Having developed a reputation of excellence and innovation over the past 21 years, we firmly believe our mixed signal and RF design and supply capabilities are ideally placed to further capitalise on the significant demand for ASICs across our key markets.

We are excited by the numerous opportunities that being a quoted company will bring and we look forward to further developing EnSilica over the coming years.”

EnSilica to list on London Stock Exchange’s AIM market, expected to begin trading from 24th May

OXFORD, United Kingdom –May 19, 2022EnSilica, the UK-headquartered specialist designer and supplier of mixed signal ASICs has announced it is set to be listed on the London Stock Exchange’s AIM market. Trading is expected to begin from the 24th May under the ticker ENSI.

AIM is the LSE’s market for small and medium sized growth companies, with over 1,200 companies listed on it.

In connection with the Admission, EnSilica has raised £6 million (USD 7.4m) through a placing and subscription of 12,000,000 Ordinary Shares at a price of 50p per share and will open with a market capitalisation of £37.6 million (USD 46.6m).

The company designs ASICs for system developers working across the automotive, satellite and healthcare sectors. Its CEO, Ian Lankshear said “Our quoted status will provide an ideal platform from which to accelerate a number of growth initiatives, which will ultimately further expand both market reach and customer footprint.

“Having developed a reputation of excellence and innovation over the past 21 years, we firmly believe our mixed signal and RF design and supply capabilities are ideally placed to further capitalise on the significant demand for ASICs across our key markets.”

EnSilica announces sensor interface IC targets wearable medical device markets

The chip, which will be initially available with evaluation boards, has been created to meet the needs of a diverse array of home-use and single-use medical sensors – from oximeters to smart plasters – as well as wearable healthcare sensors and fitness trackers.

According to EnSilica, the IC is among the first of its kind to integrate an NFC energy harvesting circuit, making it suitable for both battery-powered and battery-less systems.

A modular IC design has been implemented in the ENS62020, which allows for the customisation of the ENS62020 and enables a product-optimised ASIC while greatly reducing the time to market.

EnSilica CEO, Ian Lankshear said, “EnSilica is focused on developing ASICs in close collaboration with our customers. The ENS62020 was born out of requirements coming from a number of customers that were seeking to develop differentiated products in this fast-growing wearable healthcare and medical device market.”

According to figures provided by Deloitte, the wearable medical sensors market is forecast to grow at 19% CAGR to 2024, with 280 million smart watches/fitness trackers and 160 million wearable medical sensors shipping in 2024.

The ENS62020 healthcare sensor interface IC supports the accurate and reliable measurement of an array of vital signs including: ECG, temperature and differential capacitance, as well as optical signals, which are used to track heart rate, oxygen saturation (SpO2), glucose levels and for near-infrared spectroscopy.

According to EnSilica, due to the size and power-optimised design, the device is suited to disposable medical devices and patches as well as sports and fitness devices. The highly sensitive capacitive sensor interface also makes the device well suited for novel MEMS sensors.

The IC is designed to work alongside an edge processor, or a communication device, and incorporates two photodiode drivers/photodetector readouts; two differential ECG sensor channels suitable for 3-lead ECG with <1.6µVrms noise levels; a highly sensitive capacitive sensor channel; a temperature sensor with <0.15oC resolution (between 35-45oC); a low-power ADC. The device consumes from just ~10µA per sensor.

The device will come in a plastic QFN 32-pin package, with samples available from June, or as part of an evaluation kit with board and demonstration software from July.

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