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EnSilica and Kili Technology deliver FIPS-compliant secure processor IC

kili_PR_150_92Kili 3.1 dual eSi-3250-based processor with 1MB of embedded Flash, USB and NFC connectivity meets FIPS 140-2 Level 3 requirements and targets secure payment, authentication and identity applications.

Wokingham, UK and Toronto, Canada – 8th October 2013. EnSilica, a leading independent provider of IC design services, system solutions and IP, has announced that it has successfully collaborated with Kili Technology Corporation of Canada on the development of the Kili 3.1 FIPS 140-2 Level 3 (Federal Information Processing Standard) compliant secure processor IC. The Kili 3.1 secure processor IC is designed to meet the stringent requirements of payment, authentication and identity applications and production devices are available now.

Drawing on the IP portfolios of both companies, the joint development has been extensively underpinned by EnSilica’s design services. “The development of the Kili 3.1 secure processor IC is another prime example of how a highly focused fabless semiconductor company can collaborate with us to help bring their ideas to silicon,” said Ian Lankshear, CEO of EnSilica. “As the Internet of Things starts to broaden and really take off, the Kili 3.1 secure processor IC provides a much needed, highly-integrated solution that delivers excellent
security and connectivity features with significant potential savings on the bill of materials (BOM).”

The Kili 3.1 secure processor IC utilizes EnSilica’s high-performance, low-power 32-bit eSi-3250 soft processor core with cryptographic acceleration instructions in Kili Corporation’s patented, dual processor architecture that splits secure functionality between the processors. In addition to supplying the eSi-3250 processors complete with 1MB of embedded Flash, standard interconnect and key peripherals required for the application such as USB, I2C, UART, SPI, Smart Card reader, SWP and TRNG, EnSilica incorporated an additional APB peripheral bus to enable the easy connection of Kili’s own silicon-proven, easily portable security IP including NFC radio and ontroller.

Kili 3.1 enables the implementation of the principal cryptography protocols, including RSA, AES and DES, outside the host environment, such as a PC, laptop, tablet or smartphone. It features advanced security functions including mesh sensor; active shield protection; voltage, temperature clock and physical tamper detection; and protected battery backup of key memory with auto erase as well as encryption acceleration and EMV L1/L2 firmware for both contact and contactless applications. Software stacks for capacitive touch
and Bluetooth LE are also available, greatly reducing the time to market.

“Licensing the eSi-3250 has provided us with real technical advantages compared to other CPU cores and outsourcing the processor sub-system development to EnSilica has helped reduce our IC development time,” said Afshin Rezayee, Founder and Co-President of Kili Technology Corporation. “This has allowed us to focus on our product differentiation and the development of the IP specific to our end applications. The flexible multi-processor architecture has helped us develop novel security features to meet the all-important FIPS security certification. We will continue to use EnSilica’s eSi-RISC cores along with its front-end and physical design services to support our ongoing chip development activities.”

EnSilica and Altera Deliver Successful RRH Design

EnSilica, a leading provider of IC design services and system solutions have recently completed a major project with a Tier 1 mobile communications company, to deliver a world-class Remote Radio Head (RRH) solution based on the Altera’s High End Stratix FPGA technology.

This is another example where EnSilica’s expert knowledge of Altera technology gained through over 10 years of working together (EnSilica are a member of the Altera Design Services Network) can deliver the best possible solution for our customers. For the full details click here

EnSilica Move to New UK Headquarters

To support the continuing growth of EnSilica, we have moved to a new larger headquarters in the UK

The headquarters include a dedicated design centre, laboratory area, high-performance computer facility and extensive IT infrastructure, that will ensure the company remains at the forefront of IC design services.
Our New Address is: West Forest Gate, Wellington Rd, Wokingham, Berks RG40 2AT

Customers Endorse EnSilica’s Design Services and IP

As a provider of quality Design Services and IP, there is only one way to know if you are really doing a good job – positive feedback from your customers.

Three new testimonials, from Alcatel-Lucent, Dongbu-Hitek and Solantro talk about how EnSilica’s advanced FPGA design expertise and embedded processor technology helped these companies launch new products to the market, on time.

Alcatel_Lucent_square__100_100Alcatel-Lucent“EnSilica have supported Alcatel-Lucent in the development of a Remote Radio Head (RRH) FPGA.

EnSilica were responsible for the design and verification of a number of modules within the RRH processing chain along with the integration and verification of the top level design prior to timing closure & fitting in the chosen FPGA device. The project also included the integration of CPRI IP from the FPGA vendor into the design.

This was the best HW bring-up we have ever experienced. The quality of deliverables from EnSilica provided high confidence that the demanding timescales for the project could be achieved.”

For the full testimonial, click here

DongbuHitek_square__70_82Dongbu Hitek“At the start of our new project, there were several candidate CPUs for this product. After an extensive technical and commercial evaluation Dongbu HiTek selected the EnSilica eSi-1600 processor IP and peripherals set for our project.

Their quality IP and support made our project on-time and a success. Through silicon verification, there was no CPU issue found and we were very pleased with the result.

We have decided to use EnSilica’s IP for our next project and we are confident that EnSilica will again provide the best service and support to make this another success project.”

For the full testimonial, click here

“Technical support was perfect during the entire engagement, always prompt and relevant.

The ASIC implementation of the core performed as expected in the first tape-out.

As an early-phase start-up with a tight R&D budget, Solantro benefitted from an excellent technical and business partnership with EnSilica, allowing us to move to the next level. “

For the full testimonial, click here