AST SpaceMobile Selects EnSilica for its next gen ASIC Chip
AST SpaceMobile, selects EnSilica to develop the next generation ASIC for space-based cellular broadband network.
Entries by Ian Lankshear
EnSilica opens design centre in Sheffield
EnSilica’s new design centre in Sheffield, expertise in analogue, RF and digital design.
EnSilica @ Chip in the Fields
August 2021:Join us at the Chip in the Field Virtual Conference.
EnSilica @ IAA Mobility
September 2021:Join us at the IAA Mobility Conference.
Designing for Automotive: The Door Opens Wider for Smaller Firms
Designing for Automotive: The Door Opens Wider for Smaller Firms
Shift from 8in to 12in Wafer Fabs Could Ease IC Shortages
The economics of 8in wafers make the current supply shortages a feature, not a glitch. Shifting to 12in can help future-proof your supply chain.
EnSilica completes PPAP on safety-critical automotive ASIC design
EnSilica completes PPAP on safety-critical automotive ASIC design for a tier-1 automotive supplier
EnSilica and Alphawave partner to strengthen ASIC roots in UK & Europe
EnSilica and Alphawave partner to strengthen ASIC roots in UK & European market
EnSilica presenting at Semiconductor 360 Live 2021
EnSilica presents at Leading International Virtual Event for the Semiconductor Community in Europe and Israel
EnSilica on a new growth trajectory with next round of funding
EnSilica takes the next big step in its growth story, from pure ASIC design to ASIC design and supply.
